Samsung Electronics Co., Ltd.

Woonseong Kwon

Jung-Hwan Kim

Un-Byoung Kang

Yongjin Lee

Yonghwan Kwon

Hyuekjae Lee

Taeje Cho

Hyung-Sun Jang

Taeeun Kim

Chiyoung Lee

Jongkeun Jeon

Dong-Hun Yi

Keeseok Kim

Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the end surface, the conductive cap including a conductive cap body that extends across the end surface and a flange that extends from the conductive cap body along the conductive via sidewall towards the substrate face. Related fabrication methods are also described.

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.

Semiconductor package and method of manufacturing the same

Growing community of inventors

Seoul, South Korea

Woonseong Kwon