Samsung Electronics Co., Ltd.

Woonbae Kim

Byounguk Yoon

Jongseok Kim

Jungwoo Kim

Dong-Hun Lee

Sungchan Kang

Ji-yong Park

Yongseop Yoon

Inho Choi

Jeong-Kyu Ha

Sungeun Jo

Youngdoo Jung

Younghoon Lee

Chulhwan Lee

Eunhee Jung

Youngshin Kwon

Minjin Kim

Sungkyu Hwang

Howon Lee

Junghoon Lee

Kyoungsei Choi

Jinsu Park

Kyungkyu Kim

Sunghun Kim

Daeho Lee

Hyunggeun Lee

Soyoung Lim

Yechung Chung

Sanghoon Jung

Kyoungsuk Yang

Jaewon Yu

Jungpil Lee

Chulho Bae

Jikho Song

Sukchul Park

Hyungseok Lim

Beommo Seong

Cheolsoo Kim

Minwook Jin

A semiconductor package including a substrate including a through hole, an image sensor structure on the substrate, and a first transparent substrate on the substrate and spaced apart from the image sensor structure may be provided. The image sensor structure includes a logic chip on the substrate, a first sensing chip on an active surface of the logic chip, and a second sensing chip on an inactive surface of the logic chip and connected to the active surface of the logic chip through a first via that vertically penetrates the logic chip. On a bottom surface of the logic chip, at least a portion of one of the first sensing chip and the second sensing chip is in the through hole.

Semiconductor package including stack structure of logic chip and sensing chips

An electronic device is provided. The electronic device includes a housing and a display including a transparent plate forming a front of the electronic device, a display panel viewable from the front of the electronic device through the transparent plate, a panel flexible circuit film arranged under the rear surface of the display panel including a bending part that extends toward the front surface of the display panel in a region adjacent to a first side surface of the electronic device, the bending part being electrically connected to the display panel on the front surface of the display panel, and a first support member arranged between the rear surface of the display panel and the panel flexible circuit film, a partial region of the first support member having an area larger than that of the panel flexible circuit film within a designated distance from the first side surface.

Electronic device comprising display module

A semiconductor package may include an image sensor chip, a transparent substrate spaced apart from the image sensor chip, a joining structure in contact with a top surface of the image sensor chip and a bottom surface of the transparent substrate, on an edge region of the top surface of the image sensor chip, and a circuit substrate electrically connected to the image sensor chip. The image sensor chip may include a penetration electrode which penetrates at least a portion of an internal portion of the image sensor chip, and a terminal pad, which is on the edge region of the top surface of the image sensor chip and is electrically connected to the penetration electrode. The joining structure may include a spacer and an adhesive layer. The joining structure may overlap the terminal pad. The spacer is between the transparent substrate and the terminal pad.

Semiconductor package including image sensor chip, transparent substrate, and joining structure

An electronic device includes a circuit board, a socket on the circuit board and electrically connected to the circuit board, and a tray removably insertable into the socket from outside the electronic device, the tray including a body portion, a first protrusion extended from the body portion, and a second protrusion extended from the body and spaced apart from the first protrusion. The socket includes a detection portion which is engageable with the first protrusion of the tray and detects insertion of the tray in the socket, together with the circuit board, and a supporting portion which is engageable with the second protrusion of the tray. The tray which is inserted into the socket disposes the first protrusion contacting the detection portion, and a portion of the tray corresponding to the second protrusion supported by the supporting portion.

Tray support structure and electronic device including the same

A semiconductor package may include an image sensor chip, a transparent substrate spaced apart from the image sensor chip, a joining structure in contact with a top surface of the image sensor chip and a bottom surface of the transparent substrate, on an edge region of the top surface of the image sensor chip, and a circuit substrate electrically connected to the image sensor chip. The image sensor chip may include a penetration electrode which penetrates at least a portion of an internal portion of the image sensor chip, and a terminal pad, which is on the edge region of the top surface of the image sensor chip and is connected to the penetration electrode. The joining structure may include a spacer and an adhesive layer which is between and attached to the spacer and the image sensor chip. The joining structure may the terminal pad.

Disclosed are sensor packages, methods of manufacturing the same, and methods of manufacturing lid structures. The sensor package comprises a package substrate, a gas sensor on the package substrate, a lid on the package substrate and having a hole extending between a first inner surface and a first outer surface of the lid, the first inner surface of the lid facing toward the package substrate and the first outer surface of the lid facing away from the package substrate, and a waterproof film in the hole of the lid. The waterproof film is formed on the first inner surface and the first outer surface of the lid.

Sensor package, method of manufacturing the same, and method of manufacturing lid structure

According to certain embodiments, an electronic device may include a housing, a slidable body; a driver including: a drive motor, a rotatable drive shaft for the drive motor, and a nut frame including a latch projection, protruding in a direction of the slidable body, and a slide hinge disposed on the slidable body and coupled to the driver, wherein the slide hinge includes: a slide plate coupled to the slidable body, and a locker including a latch groove, into which the latch protrusion is inserted, wherein, when the latch projection is inserted into the latch groove, the slidable body is moved by the driver, and wherein the slide plate defines an escape area configured to receive at least a portion of the nut frame and/or the latch protrusion, when an external impact causes the latch protrusion to separate from the latch groove.

Electronic device including slidable body

Disclosed are fingerprint sensor packages and display apparatuses including the same. The fingerprint sensor package comprises a flexible film having a top surface and a bottom surface opposite to the top surface, a fingerprint sensor surrounded by a cap, and a display driver integrated circuit on the flexible film. The fingerprint sensor and the display driver integrated circuit are mounted on the top surface of the flexible film.

Fingerprint sensor package and display apparatus including the same

In an embodiment, the film product includes a film substrate having a first surface and a second surface opposite the first surface. The film substrate has a length in a first direction and a width in a second direction perpendicular to the first direction. A first plurality of pads is on one of the first surface and the second surface, and the first plurality of pads is arranged in a third direction, the third direction being diagonal with respect to at least one of the first direction and the second direction. At least one merge line is electrically connecting at least two of the first plurality of pads.

Film product, film packages and package modules using the same

A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.

Sensing module substrate and sensing module including the same

Semiconductor packages are provided. The semiconductor packages may include a base film having a top surface and a bottom surface, a circuit pattern disposed on the top surface of the base film and connected to a ground terminal, a via hole penetrating the base film, a lower shielding layer that is electrically connected to the circuit pattern and fills the whole region of the via hole and cover the bottom surface of the base.

Semiconductor packages

Growing community of inventors

Seoul, South Korea

Woonbae Kim