Applied Materials, Inc.

Woon Young Toh

Michael E Wilmer

Terry P Reiss

Sherry Cordova

Natalia Kroupnova

Clari Nolet

Yukari Nishimura

Richard C Lyon

Terry Lee Doyle

Evgueni Lobovski

Inna Louneva

The present invention provides a semiconductor processing device () including a tool () having one or more sensors, a primary data communication port () and a secondary data communication port (). A sensor data acquisition subsystem () acquires sensor data from the tool via the secondary port (). The data acquisition subsystem () acquires MES operation messages via the primary port (). Sensor data are communicated to a sensor processing unit () of a sensor data processing subsystem (). The sensor processing unit () processes and analyzes the sensor data. Additionally, the processing unit () can be adapted for making product or processing related decisions, for example activating an alarm if the process is not operating within control limits. In another embodiment, the present invention provides a method and apparatus for processing data from a wafer fab facility () including a plurality of tools () each having a primary data communication port () and a secondary data communication port ().

Wafer fabrication data acquisition and management systems

One embodiment of the present invention is a method for modifying process recipe information utilized by a wafer processing system having a controller with permanent rewritable storage, memory, a first and a second communication interface, and a user interface; and one or more process cells to process a wafer; which method comprises steps of: (a) storing baseline process recipe information in permanent rewritable storage; (b) retrieving baseline process recipe information from permanent rewritable storage for a wafer in a group of wafers to be processed and storing it in memory; (c) receiving process recipe modification information utilizing the second communication interface and storing the process recipe modification information in memory; (d) overwriting at least portions of the baseline recipe information in memory with the process recipe modification information to form new recipe information; and (e) processing the wafer utilizing the new recipe information.

Process recipe modification in an integrated circuit fabrication apparatus

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San Jose, CA, United States of America

Woon Young Toh