Infineon Technologies Ag

Woon Yau Lim

Kok Yau Chua

Matthias Steiert

Christina Yeong

Chu Hua Goh

The electronic device comprises a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face, and a substrate, wherein the semiconductor chip is disposed above the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element.

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Melaka, Malaysia

Woon Yau Lim