Zeus Company Inc.

Woon Kong

Ji Ho Park

Ji Hoon Song

Ung Jo Moon

Won Seok Choi

Seung Dae Baek

Kuem Dong Heo

Kang Won Lee

Jiho Park

Ki Hun Park

A wafer processing apparatus of the present invention includes a suction nozzle configured to suction sludge from a cup housing, a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein, a suction tank connected to the flow line such that the sludge and the chemical solution flow thereto, and an ejector installed on a flow line to generate suction pressure in the suction nozzle and the flow line.

Wafer processing apparatus and wafer processing method

A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover installed on a circumferential portion of the vacuum chuck, a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck, and a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.

Wafer processing apparatus and control method thereof

A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.

The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.

Wafer processing apparatus and method of controlling the same

A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

A wafer processing apparatus includes a rotating chuck which is rotatably installed inside a cup housing and on which a substrate is mounted, a nozzle table rotatably installed inside the rotating chuck, a guide installed inside the nozzle table, a moving module movably installed on the guide, a guide arm configured to support a fluid supply line part, a lower nozzle part coupled to the guide arm to move together with the moving module and connected to the fluid supply line part, a driving shaft part connected to the rotating chuck and the nozzle table to rotate the rotating chuck and the nozzle table, a moving shaft rotatably installed inside the driving shaft part and connected to the moving module to move the moving module, and a driver connected to the driving shaft part and the moving shaft.

Growing community of inventors

Cheonan-si, South Korea

Woon Kong