Samsung Electro-mechanics Co., Ltd.

Woon-Chun Kim

Soon-Gyu Yim

Sung Yi

Young-Do Kweon

Hwa-sun Park

Hong-Won Kim

Jae-Kwang Lee

Dae-Jun Kim

Jin-Seon Park

Yul-Kyo Chung

Hyun-Chul Jung

Jeong-Bok Kwak

Ji-Hye Shim

Sung-Taek Lim

Hyung-Mi Jung

Ga-Young Yoo

A fingerprint sensor includes a first conductive pattern formed on one side of a core, a second conductive pattern formed on the first conductive pattern, an insulating layer formed between the first conductive pattern and the second conductive pattern, a dielectric layer configured to cover the second conductive pattern, and a protective layer covering the dielectric layer, wherein the protective layer includes a photosetting resin.

Fingerprint sensor having printed circuit board and method of manufacture

Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.

Semiconductor package with a metal post and manufacturing method thereof

A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

Method of manufacturing capacitor-embedded PCB

A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

Method of manufacturing a printed circuit board with an embedded electronic component

A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.

Capacitor and manufacturing method thereof

Semiconductor package with a metal post

Electronic component embedded printed circuit board and manufacturing method thereof

A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole penetrating the substrate; forming roughness on the resin layer by a desmear process; forming a via making an electrical connection between layers through the through-hole; and forming a second circuit pattern on the resin layer having roughness formed thereon.

PCB and manufacturing method thereof

A method of manufacturing a capacitor-embedded PCB is disclosed. The method may include fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

Growing community of inventors

Suwon-si, South Korea

Woon-Chun Kim