Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Woon Chun Kim

Yong Soo Oh

Jong Young Lee

Ji Hye Shim

Kang Heon Hur

Hyun Jun Kim

Gun Goo Lee

Sung Keun Park

Jun Heyoung Park

Jae Suk Sung

Jin Uk Lee

Jumyong Park

Jang Ho Park

Won Ha Moon

Seung Hun Chae

Kyoung Soo Chae

Soon Gyu Yim

Nam Keun Oh

Seung Hyun Sohn

Sang Hwan Oh

Dae Seo Park

Hyun Seop Shim

Woon Bong Joh

Kwang Joe Jeon, Jr

Hyun Ho Lim

Jae Il Kim

A semiconductor device includes a lower structure and an upper structure on the lower structure. The lower structure includes a first semiconductor substrate, a first pad and a first dielectric layer. The first dielectric layer surrounds the first pad and exposes a top surface of the first pad. The upper structure includes a second semiconductor substrate, a second pad and a second dielectric layer. The second dielectric layer surrounds the second pad and exposes a bottom surface of the second pad. The first pad and the second pad are bonded to each other across an interfacial layer to couple the upper and lower structures to each other. The first and second pads and the interfacial layer include a same metallic material. The first and second pads have a substantially same average grain size and the interfacial layer has a different average grain size than the first and second pads.

Semiconductor device and method of fabricating the same

A semiconductor package includes a connection structure including one or more redistribution layers, a semiconductor chip disposed on the connection structure and electrically connected to the one or more redistribution layers, an encapsulant disposed on the connection structure and covering at least a portion of the semiconductor chip, and a shielding structure covering at least a portion of the encapsulant. The shielding structure includes a conductive pattern layer having a plurality of openings, a first metal layer covering the conductive pattern layer and extending across the plurality of openings, and a second metal layer covering the first metal layer. The second metal layer has a thickness greater than a thickness of the first metal layer.

Semiconductor package and electromagnetic interference shielding structure for the same

A fan-out semiconductor package includes a frame comprising a plurality of wiring layers electrically connected to one another, and having a recessed portion having a stopper layeraM disposed on a bottom surface of the recessed portion, and a through-hole penetrating through the stopper layer; a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, and disposed in the recessed portion such that the inactive surface opposes the stopper layer; an encapsulant covering at least portions of the frame and the inactive surface of the semiconductor chip, and filling at least a portion of the recessed portion; and an interconnect structure disposed on the frame and the active surface of the semiconductor chip, and comprising a redistribution layer electrically connected to the plurality of wiring layers and the connection pad.

Fan-out semiconductor package

A semiconductor package includes a semiconductor chip having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, an encapsulant encapsulating at least a portion of the semiconductor chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer and a via electrically connected to the connection pads of the semiconductor chip, wherein at least a portion of the redistribution layer and the via is formed of a metal layer having a concave portion depressed from a lower surface thereof and filled with an insulating material.

Semiconductor package

A touch sensor includes a transparent substrate, and an electrode pattern formed on the transparent substrate. The electrode pattern is formed by stacking at least two or more electrode layers, thereby enhancing the anti-corrosion and visibility of electrode patterns and ensuring the adhesive reliability of the transparent substrate and the electrode patterns.

Touch sensor

Disclosed herein are a method for manufacturing a graphene transparent electrode and a graphene transparent electrode manufactured by the method. The method includes: providing a graphene oxide solution: forming a metal thin film on a glass substrate; coating the graphene oxide solution on the metal thin film, followed by drying; primarily reducing the thus obtained graphene oxide by using a reducing agent, to obtain reduced graphene oxide; secondarily reducing the reduced graphene oxide by heat treatment under the inert atmosphere, to form a reduced layer; compressing a transparent film on the reduced layer; and etching the metal film by an etching solution. The method enables a graphene transparent electrode having economical feasibility and excellent electric conductivity to be manufactured.

Graphene transparent electrode and method for manufacturing the same

The present invention relates to a piezoelectric device of a multi-layered structure on which first electrodes and second electrodes are sequentially stacked on a piezoelectric polymer and single surfaces or both surfaces of piezoelectric polymer. In accordance with the present invention, the vibration response characteristics of the piezoelectric polymer can be improved by using the graphene or the composite thereof as a surface electrode material to the piezoelectric polymer; and, there are effects that the response characteristics of the piezoelectric device are excellent and the reliability thereof is excellent by forming a second electrode having an excellent conductivity and a protection electrode thereof.

Piezoelectric device with piezoelectric polymer material

Disclosed herein is a mutual capacitive touch panel, including: a first transparent substrate; a first bar-shaped transparent electrode formed on the first transparent substrate and divided in a length direction; first wiring whose one set of ends are connected to the first bar-shaped transparent electrode and whose the other set of ends are arranged on one side of the first transparent substrate; a second transparent substrate; a second bar-shaped transparent electrode formed on the second transparent substrate and divided in a length direction; second wiring whose one set of ends are connected to the second bar-shaped to transparent electrode and whose the other set of ends are arranged on one side of the second transparent substrate; and an adhesive layer disposed between the first bar-shaped transparent electrode and the second bar-shaped transparent electrode such that the first bar-shaped transparent electrode and the second bar-shaped transparent electrode face each other. The mutual capacitive touch panel is advantageous in that, since transparent electrodes are divided, low resistance can be realized even when the transparent electrodes are made of a conductive polymer, thus keeping up with the trend of manufacturing large touch panels.

Mutual capacitive touch panel

Disclosed herein is a touch panelincluding: bar type transparent electrodesthat are formed on a transparent substrate, bar type opening partsthat are formed in the bar type transparent electrodesso as to be surrounded by the bar type transparent electrodes, and wiringsof which one ends are connected to the bar type transparent electrodesand the other ends are collected at one side of the transparent substrate. The touch panelincludes the bar type transparent electrodesin which the bar type opening partsare formed and subdivides the transparent electrodes, thereby making it possible to improve touch sensitivity without increasing the wiringsand improve transparency.

Touch panel

Disclosed herein is a touch panel. A touch panel according to a first preferred embodiment of the present invention includes: a base member; a transparent electrode formed in an active area of the base member; an insulator formed in a bezel area of the base member, and convexly protruded from the base member; and an electrode wiring formed on an exposed surface of the insulator. In addition, a touch panel according to a second preferred embodiment of the present invention includes: a base member having a groove portion formed such that an exposed surface thereof has a concave curved surface; a transparent electrode formed in an active area; and an electrode wire connected to one end or both ends of the transparent electrode and formed on the exposed surface of the groove portion.

Disclosed herein are a touch screen and a method of manufacturing the same. The touch screen includes: a transparent substrate; a transparent electrode formed on the transparent substrate and including a sensing part sensing a touch input and an extension part extending from the sensing part to an edge of the transparent substrate; a wiring electrode formed at the edge of the transparent substrate and spaced apart from the extension part of the transparent electrode; and a conductive paste formed at the edge of the transparent substrate and covering both the extension part and the wiring electrode so as to electrically connect the transparent electrode to the wiring electrode, whereby the transparent electrode is formed after the wiring electrode is formed and the wiring electrode is connected to the transparent electrode through the conductive paste, thereby preventing the transparent electrode from being damaged.

Touch screen and method of manufacturing the same

Disclosed is a touch panel, which includes a transparent substratethat includes a base partand a projection partprojected from the base part, a transparent electrodethat is formed on the base part, signal wiringsthat are formed on the transparent substrate, having one end connected to the transparent electrodeand the other end extended to the projection part, and a controllerthat is disposed on the projection partand is directly connected to the other end of the signal wiring The touch panel directly connects the signal wiringsto the controllerby adopting the projection partto the transparent electrode, thereby making it possible to omit the flexible printing cable requiring manual work, and thus allows the roll to roll (R2R) process, thereby making it possible to automate the entire manufacturing process of the touch panel

Disclosed herein is a resistive touch screen. The resistive touch screen includes a resistive touch panel configured to include a lower substrate formed with a lower electrode pattern in an active region through which images pass, an upper substrate formed with an upper electrode pattern to be opposite to the lower electrode pattern, and a spacer spacing the upper substrate from the lower substrate in order to contact the upper electrode pattern to the lower electrode pattern by external pressure; and a window bonded to the upper portion of the resistive touch panel by an optical clear adhesive, and including a covering film formed in the outer side region on the lower surface thereof and an elastic suppressing layer formed in the inner side region of the covering film.

Resistive touch screen

Disclosed herein are a capacitive touch screen and a method for manufacturing the same. The capacitive touch screen includes: a base member on which a plurality of electrode patterns are formed; conductive adhesive members formed at ends of the electrode patterns; a window disposed over the base member and having a plurality of electrode wirings formed in an outer region thereof, the plurality of electrode wirings being opposite to the electrode patterns; and auxiliary electrodes formed at one of the ends of the electrode wirings to conduct the electrode patterns with the electrode wirings by the conductive adhesive members.

Capacitive touch screen and method for manufacturing the same

Disclosed herein is a touch screen device, including: a first transparent electrode formed on one surface of a first transparent substrate to sense a touched input; a second transparent electrode formed on one surface of a second transparent substrate formed to be opposite to the first transparent electrode to sense a touched input; a display formed on the other surface of the second transparent substrate; a first adhesive layer bonding the first transparent substrate to the second transparent substrate; and a second adhesive layer bonding a first connection part formed on an outer side of first transparent substrate to a second connection part formed on an outer side of the display. The touch screen device directly bonds the first transparent substrate to the display, thereby making it possible to provide a high definition image to a user and to reduce infiltration of moisture or the like.

Growing community of inventors

Suwon-si, South Korea

Woon Chun Kim