Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Seoul National University

Woon-bae Kim

Seung-wan Lee

Min-seog Choi

Kyu-Dong Jung

Jong-oh Kwon

Eun-sung Lee

Jeong-yub Lee

Jun-sik Hwang

Moon-chul Lee

Seung-Tae Choi

Ji-Hyuk Lim

Jong-hyeon Chang

In-sang Song

Suk-jin Ham

Che-Heung Kim

Ji-yong Park

Chang-youl Moon

Jung-woo Kim

Byung-gil Jeong

Jong-seok Kim

Yong-seop Yoon

Dong-sik Shim

Hyung Ki Choi

Jae-Min Jung

Hyung-jae Shin

Dae-cheol Seong

Jun-gu Kang

Kae-dong Back

Young-mok Kim

Chang-ho Cho

Yune-seok Chung

Jeong-Kyu Ha

Eun-seok Park

Jea-Shik Shin

Ji-hyuk Lim

Sung-chan Kang

Bo-in Noh

Go-woon Seong

Du-Sik Park

Sang-Hun Lee

Hyun Do Choi

Keon Kuk

Chang-seung Lee

Yong-sung Kim

Chang-woo Lee

Mitsuo Umemoto

Sung-hoon Choa

Eun-Sung Lee

Min-pyo Hong

Chang-kyu Choi

Woo-young Jang

Jee-hong Min

Young-chul Ko

Hwan-young Choi

Tae-sang Park

Yoon-chul Son

Pyoung-Wan Kim

Jong-woo Shin

Jae-ho You

Cheol-sung Yeon

Kyung-suk Oh

Yung-cheol Kong

Chang-Ho Cho

O-hyun Beak

Jae-Choon Kim

Seung-tae Choi

Byoung-rim Seo

Jeung-rak Lee

Seung-Goo Kang

Kyu-dong Jung

Byoung-chan Lee

Lae-soo Park

Jae-gon Lee

Jai-Ick Yoh

Kyong-soon Cho

Seung-Tae Hwang

Rae-Soo Park

Qian Wang

Yong-hyup Kim

Hyung-gae Shin

Young-sik Nam

Young-doo Jung

Mi-ae Park

Seok-hwan Lee

Hye-lynn Song

Eui-yun Jang

An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.

Integrated circuit chip, integrated circuit package and display apparatus including the integrated circuit chip

An integrated circuit chip includes a circuit structure, a grounding structure, a bonding layer between the circuit structure and the grounding structure. The circuit structure includes a first substrate, an FEOL structure, and a BEOL structure. The grounding structure includes a second substrate and a grounding conductive layer. The integrated circuit chip includes a first penetrating electrode portion connected to the grounding conductive layer based on extending through the first substrate, the FEOL structure, the BEOL structure, and the bonding layer such that the first penetrating electrode portion is isolated from direct contact with the integrated circuit portion in a horizontal direction extending parallel to an active surface of the first substrate. An integrated circuit package and a display device each include the integrated circuit chip.

Integrated circuit chips, integrated circuit packages including the integrated circuit chips, and display apparatuses including the integrated circuit chips

A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.

Chip on film package and display device including the same

A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Semiconductor package and method of manufacturing the same

A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.

Metal pillar in a film-type seconductor package

Metal pillar in a film-type semiconductor package

Provided are an optical switch, an optical probe including the optical switch, and a medical imaging apparatus including the optical probe. The optical probe includes a probe body that is configured to be insertable into a body cavity, and an optical switch that is disposed in the probe body and includes a first region formed of a material having a first refractive index, and a second region that forms an interface with the first region and is configured to have a fluid is introduced into the second region, wherein the optical switch is configured to change a path of propagation of incident light according to a second refractive index of the second region.

Optical switching unit, optical probe including the same, and medical imaging apparatus including optical probe

Laser-induced ultrasonic wave apparatuses and methods of generating images using the same. The laser-induced ultrasonic wave apparatus includes a laser source which irradiates a laser beam to a target object and a thermoelastic material; a thermoelastic material which converts the laser beam to a first ultrasonic wave and irradiates the first ultrasonic wave to the target object; and a receiving unit which receives an echo acoustic wave of the first ultrasonic wave and receives a second ultrasonic wave generated by the target object due to the laser beam.

Laser-induced ultrasonic wave apparatus and method

Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

Chip-on-film semiconductor packages and display apparatus including the same

Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.

Package for processing sensed-data, sensed-data processor, and system for processing sensed-data

A variable liquid lens system is provided. The variable liquid lens system includes a lens barrel comprising a wall and first and second ends, wherein the first and second ends are substantially transparent, at least one liquid lens disposed in the lens barrel and contacting the wall, the at least one liquid lens comprising a droplet, and a plurality of spaces containing fluid positioned on opposite sides of the at least one liquid lens inside the lens barrel. A plurality of first holes are provided in the wall at a position corresponding to the plurality of spaces. The at least one liquid lens is configured so that a position of the at least one liquid lens within the lens barrel is adjustable by adjusting amounts of the fluid contained in the plurality of spaces via the plurality of first holes.

Variable liquid lens system

A varifocal-type optical scanning probe including an optical fiber scanner and a varifocal lens is provided. The varifocal lens includes: a first membrane lens comprising a first lens surface with a variable curvature and a first pressure surface configured to induce a curvature variation of the first lens surface; a second membrane lens including a second lens surface with a variable curvature and a second pressure surface configured to induce a curvature variation of the second lens surface; a first pressure member disposed to apply a pressure to the first pressure surface; a second pressure member disposed to apply a pressure to the second pressure surface; and a motor configured to transmit a driving force to at least one of the first pressure member and the second pressure member.

Varifocal lens, optical scanning probe including the varifocal lens, and medical apparatus including the optical scanning probe

A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.

Semiconductor package with electromagnetic shielding member

Growing community of inventors

Suwon-si, South Korea

Woon-bae Kim