Samsung Electronics Co., Ltd.

Wook-Ghee Hahn

Youn-yeol Lee

Dae-Seok Byeon

Chang-Yeon Yu

Joo-kwang Lee

Young-Ho Lim

Sung-soo Lee

Ji-sang Lee

Dae Seok Byeon

Hee-Won Lee

Jai-ick Son

A non-volatile memory device includes an upper semiconductor layer including a first metal pad and vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a second metal and a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group. The upper semiconductor layer is vertically connected to the lower semiconductor layer by the first metal pad and the second metal pad.

Non-volatile memory device

In a method of reading initialization information from a non-volatile memory device, when power-up is detected, the non-volatile memory device divides a source voltage to generate a low read pass voltage which is to be provided to unselected word lines in an initialization information read operation. The low read pass voltage is set as at least one voltage between a ground voltage and the source voltage. The non-volatile memory device allows the source voltage not to be pumped in the initialization information read operation, based on the power-up. In the initialization information read operation, the non-volatile memory device provides the low read pass voltage to the unselected word lines and provides a read voltage to a selected word line to read initialization information stored in the memory cells.

Non-volatile memory device and initialization information reading method thereof

A non-volatile memory device includes an upper semiconductor layer vertically stacked on a lower semiconductor layer. The upper semiconductor layer includes a first memory group spaced apart from a second memory group in a first horizontal direction by a separation region, and the lower semiconductor layer includes a bypass circuit underlying at least a portion of the separation region and configured to selectively connect a first bit line of the first memory group with a second bit line of the second memory group.

Provided is a programming method of a nonvolatile memory device including a plurality of memory cells. The programming method of the nonvolatile memory device includes: programming a first set of memory cells of the plurality of memory cells to a target state based on a primary program voltage such that a threshold voltage distribution of the first set of memory cells is formed; grouping the first set of memory cells into a plurality of cell groups at least one cell group having a different threshold voltage distribution width from others, based on program speeds of the first set of memory cells; and reprogramming remaining cell groups other than a first cell group that is programmed to the target state among the plurality of cell groups, to the target state based on a plurality of secondary program voltages determined based on threshold voltage distribution widths of the plurality of cell groups.

Programming method of non volatile memory device according to program speed of memory cells

In a method of reading data in a nonvolatile memory device including a plurality of memory cells arranged at intersections of a plurality of word-lines and a plurality of bit-lines, a read request on a first word-line of the plurality of word-lines is received, a read operation is performed on a second word-line adjacent to the first word-line and a read operation is performed on the first word-line based on data read from memory cells of the second word-line. The read operation on the first word-line is performed by adjusting a level of recover read voltage applied to the first word-line during the read operation of the first word-line based on at least one of a program state of the data read from memory cells of the second word-line and an operating parameter of the nonvolatile memory device.

Methods of reading data in nonvolatile memory devices and nonvolatile memory devices

Programming method of non volatile memory device

A row decoder of the semiconductor memory device includes a decoding and precharging unit that is connected between a high voltage node and a block word line, wherein the decoding and precharging unit precharges the block word line, and wherein the decoding and precharging unit includes one or more decoding transistors that decode an address and form a transmission path for transmitting a block selection voltage. The row decoder further includes a pass transistor block that transmits one or more row driving voltages to row lines in response to the block selection voltage, wherein the block selection voltage is boosted according to a switching operation of the pass transistor block.

Row decoder and a memory device having the same

A non-volatile memory device and a bad block remapping method use some of main blocks as remapping blocks to replace a bad block in a main cell block and selects remapping blocks using existing block address signals. Thus, separate bussing of remapping block address signals is not needed. The bad block remapping includes comparing an external block address input from an external source to a stored bad block address, generating a bad block flag signal when the external block address is identical to the stored bad block address, generating a remapping block address selecting the remapping blocks in response to a remapping address corresponding to the bad block address, selecting one of the external block address and the remapping block address in response to the bad block flag signal to create a selected address, and outputting a row address signal in accordance with the selected address.

Non-volatile memory device and bad block remapping method

A flash memory device includes at least two mats and a row decoder shared by the mats. Each mat includes multiple word lines, bit lines, and blocks that share the bit lines. The row decoder includes a block decoder that generates a block selection signal for selecting a block, a block word line boosting circuit that generates a high voltage block word line signal in response to the block selection signal, a word line driver that drives word line drive signals driving the word lines of the selected block using drive voltages according to an operation mode and the word lines of an unselected block using a first bias voltage, and a string selection line driver that drives a string selection signal of the selected block using a drive voltage according to the operation mode and the string selection signal of the unselected block using a second bias voltage.

Flash memory device having shared row decoder

A method of programming a nonvolatile memory device including a plurality of memory cells includes providing a plurality of program loops having a corresponding plurality of program voltages associated therewith. A first one of the plurality of program loops is activated to generate a first program voltage to program a first one of the plurality of memory cells. A second one of the plurality of program loops is activated to generate a second program voltage to program a second one of the plurality of memory cells.

Flash memory devices configured to be programmed using variable initial program loops and related devices

Control circuits for a voltage regulator of a semiconductor memory device include an option fuse circuit and a fusing control circuit. The option fuse circuit includes a plurality of fuses and a selection circuit that selects one of the plurality of fuses responsive to a control signal. An output voltage associated with the voltage reset circuit is adjusted responsive to a state of the selected one of the plurality of fuses. A fusing control circuit generates the control signal to allow multiple adjustments of the output voltage by the voltage reset circuit. The option fuse circuit may be a plurality of option fuse circuits and the output voltage may be adjusted responsive to the states of the respective selected ones of the plurality of fuses of the option fuse circuits.

Voltage reset circuits for a semiconductor memory device using option fuse circuit

A semiconductor memory device comprises a cell array including a plurality of memory cells. The semiconductor memory device further comprises a plurality of bitlines formed in a bit layer and connected to the plurality of memory cells, wherein the bitlines extend from the cell array along a single direction. A common source line is formed in a common source layer and adapted to provide a predetermined source voltage to the plurality of memory cells. A voltage control block comprising a plurality of voltage control circuits adapted to control the voltage levels of the plurality of bitlines through voltage supply lines formed in a voltage-line metal layer is formed on one side of the cell array.

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Hwaseong-si, South Korea

Wook-Ghee Hahn