Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Mando Corporation

Wook Choi

Byong Jin Kim

Jae Ung Lee

Yung Woo Lee

Dong Hyun Bang

EunNaRa Cho

Ji Hyun Kim

Min Chul Shin

Ho Jeong Lim

Chang Hun Kim

KooWoong Jeong

Young Seok Kim

Seung Jae Yoo

Jae Hyun Lee

Chung Jae Lee

Yong Kap Kim

Jong Dae Jung

Dong Gun Lee

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.

Semiconductor package and manufacturing method thereof

In one example, a semiconductor device comprises a substrate, an optical device on a top side of the substrate, a translucent cover over the optical device, wherein the translucent cover is a unitary monolithic piece comprising a cover base and a cover pipe. and a cover structure on the top side of the substrate to support the translucent cover over the optical device. Some examples and related methods are also disclosed herein.

Semiconductor devices and methods of manufacturing semiconductor devices

A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and a method of manufacturing thereof, that comprises a first semiconductor die, a plurality of adhesive regions spaced apart from each other on the first semiconductor die, and a second semiconductor die adhered to the plurality of adhesive regions.

Disclosed is a sensor unit having a simple sensor structure to detect intensity of force applied to a parking cable upon braking a vehicle and an electronic parking brake with the same. The disclosed sensor unit includes a sensor housing, in which a Hall IC is installed to sense variation of magnetic force caused by displacement of a magnet, a magnet housing arranged to be movable within the sensor housing, the magnet being installed in the magnet housing, and an elastic member arranged between the magnet housing and the sensor housing, to elastically support the magnet housing. The magnet housing is coupled to a power conversion unit to operate for pulling of the parking cable or release of the pulling.

Sensor unit for measuring brake force of parking cable and electronic parking brake with the same

A solenoid valve for a brake system, which has a simplified configuration and can be easily manufactured with reduced manufacturing costs. The solenoid valve includes valve seat member integrally formed with a seat portion having a first orifice, an opening/closing member slidably installed in the valve seat member, the opening/closing member having an inner passage formed through the opening/closing member, an outer passage formed at an outer surface of the opening/closing member, a second orifice formed at one end of the opening/closing member, the second orifice having a smaller diameter than that of the first orifice, and a first opening/closing portion formed at the other end of the opening/closing member to open or close the first orifice, an opening spring to move the opening/closing member, for opening of the first orifice, a sleeve having a first end coupled to an outer surface of the valve seat member and a flange formed at the first end so as to be fixed to a modulator block, a valve core coupled to a second end of the sleeve, opposite to the first end of the sleeve, an armature slidably mounted in the sleeve, the armature having a second opening/closing portion to open or close the second orifice, and a restoring spring to press the armature toward the second orifice.

Solenoid valve for brake system

Growing community of inventors

Seoul, South Korea

Wook Choi