General Electric Company

General Electric Corporation Gmbh

Amphenol Corporation

Cooper-Standard Automotive, Inc.

Amphenol Thermometrics, Inc.

Woojin Kim

Aniela Bryzek

John Dancaster

John R Logan

George Szabo

Brian Allen Engle

Michael Klitzke

Dong-Suk Kim

Mark Sheward

Brad Jeffrey Neiman

A sensor package, and in one embodiment a sensor package for surface mount applications, that comprises a leadframe with an upper and lower surface for receiving a device thereon. Embodiments of the sensor package comprise a first device secured to the upper surface, and a second device secured to the lower surface so as to place connective pads from each of the first device and the second device proximate to one side of the leadframe. The sensor package further comprises a lead that is positioned in the sensor package in a manner that prevents electrical connection with circuitry that is external of the housing. The lead has an end proximate the side of the lead frame where the connective pads are positioned on the upper and lower surfaces. The end configured to receive connections, e.g., wirebonds, from the connective pads in a manner connecting the first device and the second device independent of any external connections of the sensor package.

Device for use as dual-sided sensor package

A catheter tip device and methods for manufacturing a catheter tip device are disclosed, the device comprising a transducer module attached to a capsule, wherein the transducer module comprises a carrier including a recessed die-attach area, a transducer die located in the recessed die-attach area, and at least one conductive lead deposited onto the carrier and interconnected to the transducer die. The recessed die-attach area has an outer perimeter greater than the outer perimeter of the transducer die forming a groove between at least one edge of the transducer die and the outer perimeter in which an adhesive agent is located to attach the transducer die to the recessed die-attach area. The methods of manufacturing the catheter tip device involve the use of an array of carriers.

Catheter tip device and method for manufacturing same

There is provided embodiments of a fluid fitting, and system incorporating the fluid fitting therein, which is compatible with harsh, caustic environments such as those environments found in the automotive industry. In one embodiment, the fluid fitting can comprise a conductive element with a fluid pathway for transporting a fluid, e.g., fuel. The fluid fitting can also comprise a non-conductive element that is coupled to the conductive element in a manner discharging electrons from the conductive body. The non-conductive element can comprise a cavity with an opening exposing a sensing device with a sensing element disposed on a sensing element housing. The sensing element housing can be sealed to the conductive element, but expose the sensing element to the fluid in the fluid pathway.

Device for measuring fluid properties in caustic environments

A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and readouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured to the second die pad. The chips are electrically coupled through the lead frame. A body formed with an over molded portion encases the isolated chip and an open molded portion formed with a recess receives the environmentally sensitive chip. An apertured cover is secured in the recess to form a protective covering over the sensor chip and for allowing communication of the sensor chip externally of the package.

Surface mount package and method for forming multi-chip microsensor device

A surface mount package for a multi-chip device has a leadframe formed with first and second die pads and leadouts from the respective die pads. An environmentally responsive sensor chip is secured to the first die pad and an environmentally isolated chip is secured to the second die pad. The chips are electrically coupled through the lead frame. A body formed with an over molded portion encases the isolated chip and an open molded portion formed with a recess receives the environmentally sensitive chip. An apertured cover is secured in the recess to form a protective covering over the sensor chip and for allowing communication of the sensor chip externally of the package.

Growing community of inventors

Irvine, CA, United States of America

Woojin Kim