Samsung Electronics Co., Ltd.

Woojae Kim

YoungHoon Ro

Sungwoo Park

Daejoong Kim

Namryul Jeon

Yonghwan Kwon

Jaeyoel Kim

HanShin Youn

Jungah Choi

Yunseok Choi

Seongryong Kang

Yechung Chung

Jonghyune Kim

In Won O

Youngki Jeon

Zhen Li

Han-shin Youn

A fingerprint sensor package includes a first substrate including a core insulating layer including first and second surfaces opposing each other and having a through-hole penetrating through the first surface and the second surface, a first bonding pad along a circumference of the through-hole on the first or second surface, and an external connection pad on an edge of the second surface, a second substrate having a third surface including a sensing region and a peripheral region surrounding the sensing region, and a fourth surface opposing the third surface, the second substrate including a second bonding pad along an edge of the third or fourth surface and bonded to the first bonding pad, and covering the through-hole, a controller chip on the fourth surface, and a molded layer on the second surface of the core insulating layer, covering the controller chip, and spaced apart from the external connection pad.

Fingerprint sensor package and smart card having the same

A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a heat dissipation structure on the package substrate, the heat dissipation structure including a center portion and an edge portion, a dam structure on a bottom surface of the center portion of the heat dissipation structure, the dam structure on a top surface of the semiconductor chip, and a heat conductive layer between the center portion of the heat dissipation structure and the semiconductor chip. A top surface of the dam structure is located at a same distance from a top surface of the package substrate in a vertical direction as a top surface of the heat conductive layer, wherein the vertical direction is perpendicular to the top surface of the package substrate.

Semiconductor packages

The present disclosure relates to a 5th (5G) generation) or pre-5G communication system for supporting a higher data transmission rate beyond a 4th (4G) generation communication system such as long term evolution (LTE). An operating method of a base station in a wireless communication system according to various embodiments of the present disclosure includes generating at least one compressed symbol based on modulation compression, transmitting to another base station, control information including position indication information which indicates a position of a subcarrier at which a first subcarrier signal is transmitted in a physical resource block (PRB) to which the at least one compressed symbol is mapped, and power indication information for indicating a transmit power of the first subcarrier signal, and transmitting the at least one compressed symbol to the another base station. Thus, transmission capacity may be optimized, and efficient modulation compression is possible.

Apparatus and method for fronthaul transmission in wireless communication system

A method for transmitting signals by a first device of a base station transmitting and receiving signals of a wireless communication system is provided. The method includes receiving a plurality of uplink signals, identifying uplink transmission shaping information to be applied to the plurality of uplink signals, and transmitting the plurality of uplink signals to a second device by applying the uplink transmission shaping. The uplink transmission shaping information is information indicating for how many time intervals the first device is to transmit the plurality of uplink signals to the second device using a fronthaul. If the plurality of uplink signals are received by the first device for a first time, the plurality of uplink signals to which the uplink transmission shaping is applied are transmitted by the first device to the second device for the first time and a time determined based on the uplink transmission shaping information.

Apparatus and method for transmitting signals using fronthaul in communication system

The present invention relates to a network structure for effectively applying a software-defined networking (SDN) technology to an LTE network and an operation of a system on the basis of the same. The present invention therefore provides a method for controlling communication by an SDN controller in an SDN-based wireless communication network, the method comprising the steps of: receiving information on a UE from a gateway controller as the UE initially accesses an eNB; selecting at least one Openflow switch (OFS) for processing traffic of the UE on the basis of the information; and transmitting a request for setting a packet forwarding rule for processing the traffic of the UE to the at least one OFS.

SDN-based LTE network structure and operation scheme

An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.

Package for semiconductor device including guide rings and manufacturing method of the same

Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.

Growing community of inventors

Hwaseong-si, South Korea

Woojae Kim