Mirae Corporation

Lg Electronics Inc.

Woo Young Lim

Chul Ho Ham

Young Geun Park

Ho Keun Song

Jae Bong Seo

Chan Ho Park

Byeng Gi Lee

Jae Myeong Song

Eui Sung Hwang

Jung Ug Han

Eung Yong Lee

A tray transferring apparatus for transferring a handling tray on which semiconductor devices are mounted prevents the semiconductor devices from being scattered or separated from the handling tray. The tray transferring apparatus includes a fixing means installed on a main frame for supporting a fixed tray, a correcting means installed on the main frame for correcting the position of the fixed tray, a gripping means installed on the main frame for gripping a handling tray, and at least one sensor for sensing gripper plates and the handling tray. A fixed tray is held by the fixing means, and right/left inclination of the fixed tray is corrected by the correcting means. An upper portion of a handling tray holding semiconductors is covered by the bottom of the fixed tray and is gripped by the gripping means.

Tray transferring apparatus with gripper mechanism

A transfer device of a handler for testing semiconductor devices is provided in which a pitch between each of a plurality of picker heads may be adjusted without replacing a cam plate. The transfer device may include a base part, a plurality of picker heads movably mounted on the base part, and a cam plate movably mounted on the base part and having a plurality of inclined cam grooves formed therein. Each picker head is connected to a corresponding cam groove by a connection part extending therebetween, with an end of each connection part movably coupled to its respective cam groove. A driving unit reciprocates the cam plate so that, as the ends of the connection parts move within the cam grooves, a position of the picker heads may be varied.

Transfer device of handler for testing semiconductor device

A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semiconductor device and allows pins on the semiconductor device to couple with connection pins on the socket board. A spacer may be interposed between the socket board and the socket guide to maintain a predetermined distance between the semiconductor device and the socket board. In this manner, the balls or the leads of each semiconductor device may be pressed onto connection pins of the socket to a predetermined depth, even when the semiconductor devices have different thicknesses.

Socket assembly for testing semiconductor device

A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

Handler for testing semiconductor devices

A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

Test tray with carrier modules for a semiconductor device handler

A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range. The semiconductor device handler includes at least one enclosed chamber, a heating/cooling apparatus configured to bring an inside of the at least one chamber to a low or high temperature state, a pushing unit provided within the at least one chamber and configured to push a plurality of semiconductor devices mounted on a test tray into test sockets of a test board located within the at least one chamber for testing, a cooling fluid supplying apparatus configured to supply cooling fluid, a nozzle assembly configured to spray cooling fluid received from the cooling fluid supplying apparatus onto the semiconductor devices fitted to the test sockets, and a control unit configured to control spraying of cooling fluid onto the semiconductor devices during testing to compensate for temperature changes of the semiconductor devices that occur during testing.

Growing community of inventors

Seoul, South Korea

Woo Young Lim