Samsung Electronics Co., Ltd.

Woo-Yeong Cho

Du-Eung Kim

Hyung-Rok Oh

Beak-Hyung Cho

Kwang-Jin Lee

Byung-Gil Choi

Sang-beom Kang

Choong-Keun Kwak

Hye-Jin Kim

Joon-Min Park

Yun-Seung Shin

Yu-hwan Ro

Sang-Beom Kang

Hyun-Geun Byun

Joon-min Park

Hye-jin Kim

Hyung-rok Oh

Chang-soo Lee

Jun-Soo Bae

Kwang-Ho Kim

Mu-Hui Park

Jong-Soo Seo

Hyun-Ho Choi

Yong-Jun Lee

Taek-Sung Kim

Ki-sung Kim

Joon-Yong Choi

Qi Wang

Young-Kug Moon

Hui-Kwon Seo

Baek-Hyung Cho

Yu-Hwan Ro

Do-Eung Kim

Yeong-taek Lee

Ki-Whan Song

Chang-Woo Oh

Hye Jin Kim

Hak-Soo Yu

Kwangjin Lee

Seong-Il O

Ki-Won Lim

Nam-Kyun Tak

Su-Yeon Kim

Dueung Kim

Choong-keun Kwak

Sang-Hoan Chang

Beakhyung Cho

Min-Su Choi

Young-Hoon Oh

Chang-han Choi

Byunggil Choi

Mu-hui Park

Hyungrok Oh

Seong-Moo Heo

Kwang-Suk Yu

Junsoo Bae

Ik-chul Kim

Du-eung Kim

Provided are a neuromorphic circuit having a three-dimensional stack structure and a semiconductor device including the neuromorphic circuit. The semiconductor device includes a first semiconductor layer including one or more synaptic cores, each synaptic core including neural circuits arranged to perform neuromorphic computation. A second semiconductor layer is stacked on the first semiconductor layer and includes an interconnect forming a physical transfer path between synaptic cores. A third semiconductor layer is stacked on the second semiconductor layer and includes one or more synaptic cores. At least one through electrode is formed, through which information is transferred between the first through third semiconductor layers. Information from a first synaptic core in the first semiconductor layer is transferred to a second synaptic core in the third semiconductor layer via the one of more through electrodes and an interconnect of the second semiconductor layer.

Neuromorphic circuit having 3D stacked structure and semiconductor device having the same

The present inventive concept provides a driving method of memory controller controlling nonvolatile memory device using variable resistive element. The memory controller may control a plurality of first memory devices and a second memory device. A number of write drivers in the second memory device may be driven when a number of first memory devices among the plurality of first memory devices are used. A different number of write drivers in the second memory device may be driven when a different number of first memory devices among the plurality of first memory devices are used.

Non-volatile memory device, driving method of memory controller controlling the non-volatile memory device and memory system including the memory controller and the non-volatile memory device

In a method of programming a phase change memory device, write data is programmed in a plurality of phase change memory cells by applying write pulses to each of the plurality of phase change memory cells. Whether each of the phase change memory cells is programmed is verified by applying verification pulses to each of the phase-change memory cells. A number of applications for the verification pulses and the intervals between respective applications of the verification pulses are varied in accordance with a verification result for each of the phase-change memory cells.

Phase change memory device, memory system, and programming method using variable verification pulses

A phase change memory device may include a memory cell array, a write driver, and/or a control unit. The memory cell array may include a plurality of memory cells. The write driver may be configured to provide a program current to the memory cell array for setting a state of a phase change material to program a selected memory cell. The write driver may be configured to provide the program current such that the program current has a plurality of steps. The control unit may be configured to receive step information for adjusting a magnitude and a width of each step of the program current during a test operation and provide the step information to the write driver during a normal operation.

Phase change memory device generating program current and method thereof

A method of biasing a memory cell array during a data writing operation and a semiconductor memory device, in which the semiconductor memory device includes: a memory cell array including a plurality of memory cells in which a first terminal of a memory cell is connected to a corresponding first line of a plurality of first lines and a second terminal of the memory cell is connected to a corresponding second line of a plurality of second lines; a bias circuit for biasing a selected second line of the second lines to a reference voltage and a non-selected second line to a first voltage; and a local word line address decoder applying the reference voltage or a pumping voltage corresponding to the first voltage to the bias circuit.

Memory cell array biasing method and a semiconductor memory device

A resistance-variable memory device includes memory cells, a high voltage circuit, a precharging circuit, a bias circuit, and a sense amplifier. Each memory cell may, for example, include a resistance-variable material and a diode connected to a bitline. The high voltage circuit provides a high voltage from a power source. The precharging circuit raises the bitline up to the high voltage after charging the bitline up to the power source voltage. The bias circuit supplies a read current to the bitline using the high voltage. The sense amplifier compares a voltage of the bitline with a reference voltage by means of the high voltage.

Resistance variable memory devices and read methods thereof

In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write circuit configured to write to the non-volatile memory cell array, and a control circuit. The control circuit is configured to store at least one erase indicator. The erase indicator is associated with at least a portion of the non-volatile memory cell array and indicates a logic state. The control circuit is configured to control the write circuit to write the logic state indicated by the erase indicator in the non-volatile memory cell array during an erase operation of the associated portion of the non-volatile memory cell array.

Semiconductor device having resistance based memory array, method of operation, and systems associated therewith

Apparatus and systems that use phase-change memory devices are provided. The phase-change memory devices may include multiple phase-change memory cells and a reset pulse generation circuit configured to output multiple sequential reset pulses. Each sequential reset pulse is output to a corresponding one of multiple reset lines. Multiple write driver circuits are coupled to corresponding phase change memory cells and to a corresponding one of the reset lines of the reset pulse generation circuit.

Apparatus and systems using phase change memories

Disclosed is a semiconductor memory device including a memory cell array having a plurality of variable resistance memory cells divided into first and second areas. An I/O circuit is configured to access the memory cell array under the control of control logic so as to access the first or second area in response to an external command. The I/O circuit accesses the first area using a memory cell unit and the second area using a page unit.

Variable resistance memory device and system

Provided are a nonvolatile memory and related method of programming same. The nonvolatile memory includes a memory cell array with a plurality of nonvolatile memory cells and a write circuit. The write circuit is configured to write first logic state data to a first group of memory cells during a first program operation using an internally generated step-up voltage, and second logic state data to a second group of memory cells during a second program operation using an externally supplied step-up voltage.

Nonvolatile memory, memory system, and method of driving

A phase change memory device performs a program operation by receiving program data to be programmed in selected memory cells, sensing read data already stored in the selected memory cells by detecting respective magnitudes of verify currents flowing through the selected memory cells when a verify read voltage is applied to the selected memory cells, determining whether the read data is identical to the program data, and upon determining that the program data for one or more of the selected memory cells is not identical to the corresponding read data, programming the one or more selected memory cells with the program data.

Phase change memory devices and systems, and related programming methods

A phase-change random access memory device is provided. The phase-change random access memory device includes a global bit line connected to a write circuit and a read circuit, multiple local bit lines, each being connected to multiple phase-change memory cells, and multiple column select transistors selectively connecting the global bit line with each of the multiple local bit lines, each column select transistor having a resistance that varies depending on its distance from the write circuit and the read circuit.

Variable resistance memory device and system thereof

Embodiments of the invention provide a multi-layer semiconductor memory device and a related error checking and correction (ECC) method. The multi-layer semiconductor memory device includes first and second memory cell array layers, wherein the first memory cell array layer stores first payload data. The multi-layer semiconductor memory device also includes an ECC engine selectively connected to the second memory cell array layer and configured to receive the first payload data, generate first parity data corresponding to the first payload data, and store the first parity data exclusively in the second memory cell array layer.

Multi-layer semiconductor memory device comprising error checking and correction (ECC) engine and related ECC method

A method programs a phase change memory device. The method comprises receiving program data for selected memory cells; generating bias voltages based on reference cells; sensing read data stored in a selected memory cell by supplying the selected memory cell with verification currents determined by the bias voltages; determining whether the read data is identical to the program data; and upon determining that the program data for one or more of the selected memory cells is not identical to the corresponding read data, iteratively applying a write current to the one or more selected memory cells.

Disclosed is a method of driving a multi-level variable resistive memory device. A method of driving a multi-level variable resistive memory device includes supplying a write current to a variable resistive memory cell so as to change resistance of the variable resistive memory cell, verifying whether or not changed resistance enters a predetermined resistance window, the intended resistance window depending on the resistance of reference cells, and supplying a write current having an increased or decreased amount from the write current supplied most recently on the basis of the verification result so as to change resistance of the variable resistive memory cell.

Method of driving multi-level variable resistive memory device and multi-level variable resistive memory device

Growing community of inventors

Suwon-si, South Korea

Woo-Yeong Cho