Skhynix Inc.

Woo-Tae Lee

Tae-Hoon Kim

Sang-Hyun Ban

Hye-Jung Choi

Myoung-Sub Kim

Hyun-Jeong Kim

Seung-Hwan Lee

Seok-Man Hong

Uk Hwang

Gwang-Sun Jung

Beom-Seok Lee

Provided is an electronic device including a semiconductor memory. The semiconductor memory may include: a plurality of first lines; a plurality of second lines; a plurality of memory cells disposed in respective intersection regions between the plurality of first lines and the plurality of second lines; a first test circuit configured to apply a stress pulse to a first selection line coupled to a defective memory cell among the plurality of memory cells during a first test period, in response to a first test control signal, the first selection line including any one of the plurality of first lines; and a control unit configured to generate the first test control signal based on a first test mode signal.

Electronic device for changing short-type defective memory cell to open-type defective memory cell by applying stress pulse

A method drives an electronic device including a semiconductor memory in a test mode. The method includes applying a stress pulse simultaneously to a plurality of memory cells to turn on the plurality of memory cells, determining whether the memory cells are turned on or turned off, and applying a second maximum voltage to a selected memory cell of the plurality of memory cells only when the selected memory cell is determined to be in a turned-off state.

Method for driving an electronic device including a semiconductor memory in a test mode

A chalcogenide material and an electronic device are provided. The chalcogenide material may include 1-10 atomic percent (at %) of silicon, 10-20 at % of germanium, 25-35 at % of arsenic, 40-50 at % of selenium, and 1-10 at % of tellurium. The electronic device may include a switching element including a chalcogenide material, the chalcogenide material including 1-10 atomic percent (at %) of silicon, 10-20 at % of germanium, 25-35 at % of arsenic, 40-50 at % of selenium, and 1-10 at % of tellurium. The electronic device may further include a first electrode electrically coupled to the switching element and a second electrode electrically coupled to the switching element.

Chalcogenide material and electronic device including the same

A chalcogenide material and an electronic device are provided. The chalcogenide material may include 0.1-5 atomic percent (at %) of silicon, 15-22 at % of germanium, 30-35 at % of arsenic and 40-50 at % of selenium. The electronic device may include a semiconductor memory device, the semiconductor memory device including a first memory cell that includes a first switching element. The first switching element may include a chalcogenide material including 0.1-5 atomic percent (at %) of silicon, 15-22 at % of germanium, 30-35 at % of arsenic, and 40-50 at % of selenium.

An electronic device includes a semiconductor memory. The semiconductor memory includes a plurality of first lines; a plurality of second lines; a plurality of memory cells disposed in respective intersection regions between the first lines and the second lines and coupled between the first lines and the second lines, the plurality of memory cells having a first turn-on voltage; and a test circuit block suitable for applying a stress pulse having a voltage level equal to or higher than the first turn-on voltage to one or more first lines selected from the first lines in a test mode.

Semiconductor memory capable of reducing an initial turn-on voltage of a memory cell using a stress pulse in a test mode, and method for driving the same

A method for reading data of a memory cell including a resistive memory element having a low resistance state and a high resistance state according to stored data and a selection element may include applying a recovery voltage to both ends of the memory cell, and applying a read voltage to both ends of the memory cell and sensing the data. The recovery voltage may be equal to or more than a second voltage obtained by adding a drift value of the memory cell to a first voltage for turning on the memory cell in a case in which the resistive memory element is in the low resistance state.

Electronic device and method for reading data of resistive memory cell including drift recovery

An electronic device includes a semiconductor memory, and the semiconductor memory includes a memory cell including a resistive memory element having a high resistance state and a low resistance state according to stored data, a selection element coupled serially to the resistive memory element, and a current clamping transistor electrically connected to a first end of the memory cell to limit an amount of a current flowing through the memory cell. In a drift recovery operation of the memory cell, a rising pulse voltage may be applied to a second end of the memory cell in a state in which the current clamping transistor has been turned off, the first end facing the second end.

Electronic device using resistive memory element and a recovery operation to compensate for threshold drift

Provided is an electronic device including a semiconductor memory. The semiconductor memory may include a memory region comprising a plurality of memory cells disposed at respective intersections between a plurality of row lines and a plurality of column lines, the plurality of row lines extending in a first direction, the plurality of column lines extending in a second direction crossing the first direction; first and second row drivers arranged on one side and the other side of the memory region in the first direction, respectively, and driving a common row line corresponding to a row address among the plurality of row lines; and a column driver driving a common column line corresponding to a column address among the plurality of column lines, wherein the first and second row drivers are coupled to the common row line.

Electronic device

A semiconductor memory includes a cell array including a plurality of resistive memory cells arranged in a plurality of columns and a plurality of rows, the plurality of resistive memory cells having a snapback characteristic; and a read circuit configured to apply a read voltage to a memory cell selected among the plurality of resistive memory cells, and sense data stored in the selected memory cell by determining whether or not a snapback phenomenon has occurred in the selected memory cell, wherein the read voltage has a level higher than a level of a first voltage and lower than a level of a second voltage, wherein the snapback phenomenon occurs when the first voltage is applied to the selected memory cell in a case where the selected memory cell stores first data, and wherein the snapback phenomenon occurs when the second voltage is applied to the selected memory cell in a case where the selected memory cell stores second data.

Electronic device and method for reading data stored in resistive memory cell

A semiconductor memory includes first to third lines, the second line crossing the first and third lines between the first line and the third line, a first memory element overlapping an intersection region of the first and second lines between the first line and the second line, the first memory element including a first memory layer, a first electrode under the first memory layer, and a second electrode over the first memory layer, and a second memory element overlapping an intersection region of the second and third lines between the second line and the third line, the second memory element including a second memory layer, a third electrode under the second memory layer, and a fourth electrode over the second memory layer. An electrical resistance relation of the third and fourth electrodes is controlled according to an electrical resistance relation of electrical resistances of the first and second electrodes.

An electronic device includes a semiconductor memory. The semiconductor memory includes a vertical electrode layer formed over a substrate and extending in a vertical direction substantially perpendicular to a surface of the substrate; an interlayer dielectric layer and a structure formed over the substrate and alternately stacked along the vertical electrode layer, wherein the structure includes a horizontal electrode layer and a base layer which is conductive and located over or under the horizontal electrode layer; a variable resistance layer interposed between the vertical electrode layer and the base layer, and including a common element with the base layer; and a groove interposed between the vertical electrode layer and the horizontal electrode layer and insulating the vertical electrode layer and the horizontal electrode layer from each other.

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Seoul, South Korea

Woo-Tae Lee