Samsung Electro-mechanics Co., Ltd.

Woo Sup Kim

Jong Han Kim

Kang Heon Hur

Joon Hee Kim

Jin Woo Kim

Jong Ho Lee

Chin Mo Kim

Hak Kwan Kim

Chang Hwa Park

Hong Seok Kim

Min Gi Sin

Chi Hwa Lee

Hae Sung Park

Dong Gun Kim

Kyeong Jun Kim

Sun Cheol Lee

Chan Kong Kim

Kyu Ho Lee

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.

Dielectric composition and multilayer ceramic capacitor containing the same

A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Laminated chip electronic component, board for mounting the same, and packing unit thereof

The non reducible dielectric ceramic composition comprising a main component of (BaCa)(TiZr)O, subcomponents of MgO, ReO, MO, MnO and VOwhere Re is one or more elements selected from the group of Y, Dy and Ho and M is one or two elements selected from the group of Ba and Ca, and a sintering aid of SiO, wherein when the composition is represented by the formula 100(BaCa)(TiZr)O+bMgO+cReO+dMO+eMnO+fVO+gSiO, the ratio of the components satisfies the conditions of 0.005&#x2266;x&#x2266;0.15, 0.995&#x2266;m&#x2266;1.03, 0.0005&#x2266;y&#x2266;0.005, 0.1&#x2266;b&#x2266;3.0, 0.1&#x2266;c&#x2266;3.0, 0.05&#x2266;d&#x2266;2.0, 0.05&#x2266;e&#x2266;50.3, 0.0.&#x2266;f&#x2266;0.1, and 0.2&#x2266;g&#x2266;3.0 based on the molar ratio.

Non reducible dielectric ceramic composition and super-thin multi-layer ceramic capacitor using the same

Disclosed herein are a multilayer ceramic capacitor, a dielectric composition capable of sintering at a lower temperature and having a small variation in dielectric constant, a multilayer ceramic capacitor using the same, and a method thereof. The dielectric composition includes BaTiO, MgCO, YO, CrO, MnVO, and xBaO-yZrO-zSiOacting as a sintering agent (where 0.1&#x2266;x&#x2266;0.3, 0.1&#x2266;y&#x2266;0.3 and 0.4&#x2266;z&#x2266;0.8, x+y+z=1), wherein when representing the composition with the formula aBaTiO-bMgCO-cYO-dCrO-e(MnVO)-f(xBaO-yZrO-zSiO), the ratio of the components satisfies the conditions of a=100, 0.1&#x2266;b&#x2266;3.0, 0.3&#x2266;c&#x2266;2.0, 0.05&#x2266;d&#x2266;0.2, 0.01&#x2266;e&#x2266;1.5, 0.5&#x2266;f&#x2266;3.0 based on the molar ratio. When manufacturing a multilayer ceramic capacitor of a higher capacitance, which is formed to have the thin layer structure of 4 &#x3bc;m or less, short circuits between internal electrodes and the deterioration in capacitance due to massing of the electrodes into ball at the ends may be remarkably reduced.

Dielectric composition for multilayer ceramic capacitor, multilayer ceramic capacitor, and method for manufacturing multilayer ceramic capacitor

A low temperature sinterable dielectric ceramic composition and a multilayer ceramic chip capacitor. The dielectric ceramic composition is expressed by the general formula: aBaTiO-bMgCO-cYO-dCrO-eVO-f(xZrO-y(K,Li)O-zSiO) (x+y+z=1; 0.05&#x2266;x&#x2266;0.18, 0.01&#x2266;y&#x2266;0.08, and 0.7.4&#x2266;z&#x2266;0.93); in which a, b, c, d, e and f are molar ratios; a=100, 1.0&#x2266;b&#x2266;2.0, 0.2&#x2266;c&#x2266;2.0, 0.02&#x2266;d&#x2266;0.3, 0.02&#x2266;e&#x2266;0.3, and 0.5&#x2266;f&#x3c;2. The multilayer ceramic chip capacitor is prepared using the dielectric ceramic composition. The dielectric composition according to the present invention can be sintered at a low temperature without decrease of a dielectric constant, making it possible to make ultra thin-layered dielectrics.

Low temperature sinterable dielectric ceramic composition and multilayer ceramic chip capacitor using the same

A dielectric ceramic composition of high dielectric constant and low dielectric loss, which can be co-fired with Ag electrodes, is provided for use in various parts of electric and electronic appliances. Based on a base composition with a high dielectric constant, the composition comprises glass frit and optionally CuO, as represented by the following formula:wt. % {CaO-SmO-NdO-LiO-TiOwt. % (ZnO&#x2014;BO&#x2014;SiObased or LiO&#x2014;BO&#x2014;SiObased glass frit)+wt. % CuO

Dielectric ceramic composition

Non-reducable, low temperature dielectric ceramic composition, capacitor and method of preparing

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Kyungki-do, South Korea

Woo Sup Kim