Cheil Industries Inc.

Samsung Sdi Co., Inc.

Woo-Han Kim

Sang-Ran Koh

Eun-Seon Lee

Hong-Jung Yoo

Young-Ho Kim

Sung-Hwan Cha

Ha-Neul Kim

Chi-Won An

Jin-Hee Bae

Hui-Chan Yun

Dong-Ju Shin

Taek-Soo Kwak

Jun-Young Jang

Yoong-Hee Na

Byeong-Gyu Hwang

Bo-Sun Kim

Wan-Hee Lim

Hyun-Jung Ahn

Sae-Mi Park

June-Ho Shin

Doo-Ri Song

Yong Kook Kim

Ha Neul Kim

Chi Won An

Il Yong Jung

Han-Song Lee

Kun-Bae Noh

Jun Sakong

Dong-il Han

Chang-Soo Woo

Yun-Hee Baek

Jin-Gyo Kim

Yong-Kook Kim

Dong-II Han

A composition for forming a silica based layer, the composition including a silicon-containing polymer having polydispersity ranging from about 3.0 to about 30 and a solvent, and having viscosity ranging from about 1.30 centipoise (cps) to about 1.80 cps at 25&#xb0; C. Also, a silica based layer is formed of the composition, and an electronic device includes the silica based layer.

Composition for forming a silica based layer, silica based layer, and electronic device

A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.

Composition for forming silica layer, silica layer, and electronic device

A composition for forming a silica layer includes a silicon-containing polymer and a solvent, wherein the silicon-containing polymer has a total sum of Si&#x2014;H integral values in aH-NMR spectrum of less than or equal to about 12. The sum of the Si&#x2014;H integral values is calculated under conditions described in the specification.

Composition for forming silica layer, method for manufacturing silica layer, and silica layer

Provided are a composition for an encapsulant having a viscosity of about 4,000 to about 9,500 mPa&#xb7;s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23&#xb0; C., whereby maintaining a phosphor precipitation degree within about 18% when including a phosphor and allowed to stand at about 23&#xb0; C. for greater than or equal to about 2 hours, and including at least one first siloxane compound having a silicon-bonded hydrogen (Si&#x2014;H) and at least one second siloxane compound having a silicon-bonded alkenyl group (Si-Vi), an encapsulant obtained by curing the composition, and an electronic device including the encapsulant.

Composition for encapsulant and encapsulant and electronic device

Disclosed are a curable polysiloxane composition for an optical device including at least one kind of a first siloxane compound represented by Chemical Formula 1, at least one kind of a second siloxane compound having hydrogen bound to silicon (Si&#x2014;H) at the terminal end, and at least one kind of a third siloxane compound having an alkenyl group bound to silicon (Si-Vi) at the terminal end, an encapsulating material obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulating material.(RRRSiO)(RRSiO)(L-O)(L-O)(RRSiO)(L-O-L-O)(RSiO&#x2014;Y&#x2014;SiOR)(RRSi&#x2014;Y)(RSiO)(RSiO)(SiO&#x2014;Y&#x2014;SiO)(SiO)&#x2003;&#x2003;[Chemical Formula 1] In Chemical Formula 1, Rto R, Yto Y, M1, D1 to D7, T1 to T3 and Q1 are the same as defined in the specification.

Curable polysiloxane composition for optical device, encapsulating material and optical device

A curable organo polysiloxane composition, an encapsulant, and an electronic device, the composition including at least one compound represented by the following Chemical Formula 1 and having a number average molecular weight of less than about 4,000, at least one first siloxane compound including a silicon-bonded hydrogen; and at least one second siloxane compound including a silicon-bonded alkenyl group: 

Curable organo polysiloxane composition, encapsulant, and electronic device

Disclosed are a curable polysiloxane composition for an optical device includes at least one of a first siloxane compound represented by the following Chemical Formula 1, at least one of a second siloxane compound having silicon-bonded hydrogen (Si&#x2014;H) at the terminal end, and at least one of a third siloxane compound having a silicon-bonded alkenyl group (Si-Vi) at the terminal end, an encapsulant obtained by curing the curable polysiloxane composition for an optical device, and an optical device including the encapsulant.(RRRSiO)(RRSiO)(RRSiO)(RSiO&#x2014;Y&#x2014;SiOR)(RSiO)(RSiO)(RSiO)(SiO&#x2014;Y&#x2014;SiO)(SiO)&#x2003;&#x2003;[Chemical Formula 1] In the above Chemical Formula 1, Rto R, Y, Y, M1, D1, D2, D3, T1, T2, T3, T4 and Q1 are the same as defined in the specification.

Curable polysiloxane composition for optical device and encapsulant and optical device

A siloxane monomer obtained from a compound represented by Chemical Formula 1 and a compound represented by Chemical Formula 2, an encapsulant composition including the siloxane monomer, an encapsulant obtained by curing the encapsulant composition, and an electronic device including the encapsulant are disclosed.

Siloxane monomer, encapsulant composition, encapsulant and electronic device

Disclosed are a composition for an encapsulant that includes a first polysiloxane including a moiety represented by Chemical Formula 1 and an alkenyl group bound to silicon (Si&#x2014;Vi) at the terminal end and a second polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at the terminal end, an encapsulant obtained by curing the composition for an encapsulant, and an electronic element including the encapsulant.

Composition for encapsulant, encapsulant, and electronic element

A composition for an encapsulant, an encapsulant, and an electronic device, the composition including an adhesion-promoting agent, the adhesion-promoting agent including an epoxy group in an amount of about 2.0 to about 5.0 mmol/g, at least one first polysiloxane that includes a hydrogen bound to a silicon at a terminal end thereof, and at least one second polysiloxane that includes an alkenyl group bound to a silicon at a terminal end thereof.

Composition for encapsulant, encapsulant, and electronic device

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si&#x2014;H/Si-Vi) of hydrogen bound to silicon (Si&#x2014;H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.

Resin for transparent encapsulation material, and associated encapsulation material and electronic device

A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure, 

Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material

A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si&#x2014;H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si&#x2014;Vi) at its terminal end, wherein a ratio (Si&#x2014;H/Si&#x2014;Vi) of hydrogen bound to silicon (Si&#x2014;H) in the first polysiloxane to the alkenyl group bound to silicon (Si&#x2014;Vi) in the second polysiloxane is about 1 to about 1.

A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure: 

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Suwon-si, South Korea

Woo-Han Kim