Hyundai Motor Company

Kia Motors Corporation

Lg Innotek Co., Ltd.

Industry-university Cooperation Foundation Hanyang University

Amogreentech Co., Ltd.

Industry-academic Cooperation Foundation

Woo Chul Kim

Min Woo Kang

Jong Hyun Kim

Jin Woo Kwak

Byung Wook Kim

Hoo Dam Lee

Hyung Eui Lee

Young Sam Yoo

Jun Phil Hwang

Woo Ju Lee

Ji Yong Kim

Yoo Min Eom

Jong Ryoul Kim

Han Ho Oh

Yong-Sul Song

Dong Keon Lee

Hwan Joo Park

An Fe-based soft magnetic alloy is provided. The Fe-based soft magnetic alloy can be represented by empirical formula FeBCCu, and in the empirical formula, a, b, c and d are atomic percent (at %) of the corresponding element and are respectively 78.5&#x2264;a&#x2264;86, 13.5&#x2264;b+c&#x2264;21 and 0.5&#x2264;d&#x2264;1.5. The alloy has a high saturated magnetic flux density, excellent high frequency characteristics and low coercivity, and thus greatly facilitates the development of use as high performance/high efficiency small/lightweight parts. Since manufacturing costs are very low and the components contained in an alloy are easily controlled in an alloy manufacturing process, thereby enabling mass production of the alloy, the present invention can be widely applied as magnetic parts of electric and electronic devices such as a high power laser, a high frequency power supply, a high-speed pulse generator, an SMPS, a high-pass filter, a low-loss high frequency transformer, a fast switch and wireless charging.

Fe-based soft magnetic alloy, manufacturing method therefor, and magnetic parts using Fe-based soft magnetic alloy

A thermoelectric module includes an N-type thermoelectric material and a P-type thermoelectric material disposed so as to be spaced apart from the N-type thermoelectric material. A flexible electrode is electrically connected to the N-type thermoelectric material and the P-type thermoelectric material. The flexible electrode is configured to bend to match a curvature of an object, e.g., a steering wheel of a vehicle.

Thermoelectric module and manufacturing method thereof

A thermoelectric device is disclosed. The thermoelectric device comprises: a body part comprising a hollow in which a semiconductor device is disposed; a plurality of connecting parts protruding on the lateral sides of the body part and comprising connecting holes; and a plurality of electrode parts connected to the semiconductor device and extending to the connecting holes of the connecting parts.

Thermoelectric device and thermoelectric module

Growing community of inventors

Seoul, South Korea

Woo Chul Kim