Samsung Electronics Co., Ltd.

Wonyoung Kim

Jinchan Ahn

Taeyoung Kim

Kyungseon Hwang

Seokhong Kwon

A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, a molding member on the package substrate to cover at least a portion of the semiconductor chip, and a mechanical reinforcing member provided around the semiconductor chip within the molding member and extending in at least one direction.

Semiconductor package and method of manufacturing semiconductor package

A semiconductor package includes a semiconductor chip having chip pads on a first surface and having first and second side surfaces opposite to each other and third and fourth side surfaces opposite to each other, a molding member covering the third and fourth side surfaces and exposing the first and second side surfaces of the semiconductor chip, a redistribution wiring layer on a lower surface of the molding member to cover the first surface of the semiconductor chip and including a plurality of redistribution wirings electrically connected to the chip pads, and outer connection members arranged in a connection region defined on an outer surface of the redistribution wiring layer and electrically connected to the redistribution wirings.

Method of manufacturing semiconductor device including cutting a molding member and a redistribution wiring layer and a cutting region of a base substrate

A semiconductor module includes a module substrate, a semiconductor package mounted on the module substrate, a first bonding wire connecting the module substrate to the semiconductor package, and a first molding member covering the first bonding wire. The semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, a second bonding wire connecting the package substrate to the semiconductor chip, and a second molding member covering the semiconductor chip and the second bonding wire. The first and second bonding wires are each connected to one connection pad of the package substrate.

Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire

Semiconductor package having a semiconductor chip and outer connection members arranged in a connection region and method of manufacturing semiconductor package

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Suwon-si, South Korea

Wonyoung Kim