General Electric Company

Globalfoundries Inc.

Wontae Hwang

Jason Harris Karp

Dae-han Choi

William Albert Challener

Adam Edgar Klingbeil

Guanghua Wang

Vinay Bhaskar Jammu

Dae Geun Yang

Omowoleola Chukwuemeka Akinyemi

Chang Ho Maeng

Mohamed Sakami

Il Goo Kim

Sang Cheol Han

Jeremy Vanderover

Jae Hee Hwang

A system for optically monitoring a gas turbine engine includes a viewport into the gas turbine engine, and an optical connection having a first axial end and a second axial end. The first axial end is optically coupled to the viewport and configured to receive an image from the viewport, the optical connection includes a substrate having multiple hollow passages each extending from the first axial end to the second axial end, and each hollow passage includes a reflective coating disposed on an inner surface of the hollow passage to facilitate transmission of a respective portion of the image from the first axial end to the second axial end. In addition, the system includes a detector array in optical communication with the second axial end of the optical connection. The detector array includes multiple detection elements configured to receive multiple respective portions of the image from the hollow passages.

Optical monitoring system for a gas turbine engine

A system for on-line optical monitoring of a gas turbine engine includes a viewport into a combustor of the gas turbine engine and an optical filter optically coupled to the viewport. The optical filter is configured to receive broad wavelength band thermal radiation from an interior surface of the combustor while the gas turbine engine is in operation, to substantially block wavelengths of the broad wavelength band thermal radiation emitted and/or absorbed by a flame and/or by exhaust gas within the combustor, and to output narrow wavelength band thermal radiation from the interior surface of the combustor. The system also includes a detector array in optical communication with the optical filter. The detector array is configured to receive the narrow wavelength band thermal radiation and to output signals indicative of a two-dimensional intensity map of the narrow wavelength band thermal radiation.

System and method for on-line optical monitoring and control of a gas turbine engine

A system for optically monitoring a gas turbine engine includes a viewport having an opening disposed within a casing of the gas turbine engine. The opening extends from an interior side of the casing to an exterior side of the casing, and the viewport is configured to receive an image from inside the casing. The system also includes an optical connection positioned outside the casing and optically coupled to the viewport. The optical connection is configured to convey the image from the viewport to a detector array, and the optical connection includes multiple optical fibers fused to one another to form a unitary substantially rigid fiber bundle.

A system for optically monitoring a gas turbine engine includes an optical multiplexer configured to receive multiple images from respective viewports into the gas turbine engine. The optical multiplexer includes a movable reflective device configured to selectively direct at least a portion of each image toward a detector array, and the detector array is directed toward a fixed location on the optical multiplexer.

Various systems and method for controlling exhaust gas recirculation in an internal combustion engine are provided. In one embodiment, a method for controlling an engine includes determining an actual intake oxygen concentration, adjusting a donor cylinder fuel injection amount to drive the actual intake oxygen concentration to a designated intake oxygen concentration, and adjusting a non-donor cylinder fuel injection amount dependent upon the donor cylinder fuel injection adjustment and to maintain a second operating parameter.

Systems and methods for controlling exhaust gas recirculation composition

Methods are provided for facilitating fabricating a semiconductor device by selectively etching a gate structure sidewall(s) to facilitate subsequent sidewall spacer isolation. The method includes, for instance: providing a gate structure with a protective layer(s) over the gate structure, the gate structure including one or more sidewalls; selectively removing a portion of the gate structure along at least one sidewall to partially undercut the protective layer(s); and forming a sidewall spacer(s) over the sidewall(s) of the gate structure, with a portion of the sidewall spacer at least partially filling the partial undercut of the protective layer(s), and residing below the protective layer(s). In certain embodiments, the selectively removing includes implanting the sidewall(s) with a dopant to produce a doped region(s) of the gate structure, and subsequently, at least partially removing the doped region(s) of the gate structure selective to an undoped region of the gate structure.

Selective removal of gate structure sidewall(s) to facilitate sidewall spacer protection

Methods for fabricating integrated circuits are provided herein. In an embodiment, a method for fabricating an integrated circuit includes providing a mandrel layer overlying a semiconductor substrate and patterning the mandrel layer into mandrel structures. The method further includes forming a protective layer between the mandrel structures. Spacers are formed around each of the mandrel structures and overlying the protective layer to define exposed regions of the protective layer and covered regions of the protective layer. The exposed regions of the protective layer are etched using the spacers and the mandrel structures as a mask. The spacers are removed from the covered regions of the protective layer. The covered regions of the protective layer form mask segments for etching the semiconductor substrate. The method removes the mandrel structures and etches the semiconductor substrate exposed between mask segments to form semiconductor fin structures.

Methods for fabricating integrated circuits with improved semiconductor fin structures

A process is provided for selective removal of one or more unwanted fins during FINFET device fabrication. In one aspect, the process includes: providing a conformal protective layer over multiple fin structures on a substrate; patterning one or more openings over the unwanted fin structure(s); and removing at least a top portion of the unwanted fin structure(s) exposed through the opening(s), the removing including removing at least a portion of the conformal protective layer over the unwanted fin structure(s) exposed through the opening(s). In enhanced aspects, the removing includes removing a hard mask from the at least one unwanted fin structure(s) exposed through the opening(s), and selectively removing semiconductor material of at least one unwanted fin structure(s). The conformal protective layer protects one or more remaining fin structures during the selective removal of the semiconductor material of the unwanted fin structure(s).

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Clifton Park, NY, United States of America

Wontae Hwang