Samsung Electronics Co., Ltd.

Wonseop Lee

Dohyung Kim

Hwanwook Park

Dongyoon Seo

Jeonghoon Baek

Jinoh Ahn

Seunghee Mun

Yunho Lee

Bora Kim

Kyeongseon Park

Yejin Cho

Sangkeun Kwak

Daae Heo

Seungyeong Lee

A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kmodule clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)module clock signal terminal; and a fourth signal line for connecting the (k+1)module clock signal terminal to a 2kmodule clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.

Module board and memory module including the same

A PCB includes a plurality of layers spaced apart in a vertical direction, a first detection pattern and a second detection pattern and pads connected to the first detection pattern and the second detection pattern. The first detection pattern and the second detection pattern are provided in a respective one of a first layer and a second layer adjacent to each other such that the first detection pattern and the second detection pattern are opposed to each other. The pads are provided in an outmost layer. Each of the first detection pattern and the second detection includes at least one main segment extending in at least one of first and second horizontal directions and a diagonal direction. A time domain reflectometry connected to a pair of pads detects a misalignment of the PCB by measuring differential characteristic impedance of the first detection pattern and the second detection pattern.

Printed circuit boards and memory modules

A memory module including: a first printed circuit board; a first socket and a second socket; and a daisy chain pattern formed in a first region of the first printed circuit board and connected to the first socket and the second socket, wherein an electrical signal on the daisy chain pattern is transferred to a host device when the first socket and the second socket are connected to the host device.

Memory module for protection of a circuit, a memory module protection device, and a memory module protection system

Growing community of inventors

Daegu, South Korea

Wonseop Lee