Samsung Electronics Co., Ltd.

New Power Plasma Co., Ltd.

Wonpil Lee

Seunghwan Kim

Jongho Park

Jongho Lee

Changkyu Choi

Sangsoo Kim

Yongkwan Lee

Daewook Kim

Junyoung Oh

Boeun Jang

Yongseok Seo

Seokyeon Hwang

Jaeho Kwak

A surface treatment apparatus and a surface treatment system having the same are disclosed. The surface treatment apparatus includes a process chamber in which the surface treatment process is conducted, a plasma generator for generating process radicals as a plasma state for the surface treatment process, the plasma generator being positioned outside of the process chamber and connected to the process chamber by a supply duct, a heat exchanger arranged on the supply duct and cooling down temperature of the process radicals passing through the supply duct and a flow controller controlling the process radicals to flow out of the process chamber. The flow controller is connected to a discharge duct through which the process radicals are discharged outside the process chamber. The plasma surface treatment process is conducted to the package structure having minute mounting gap without the damages to the IC chip and the board.

Apparatus for conducting plasma surface treatment, board treatment system having the same

Growing community of inventors

Yongin-si, South Korea

Wonpil Lee