Samsung Electronics Co., Ltd.

Wonkyun Kwon

Chulyong Jang

A semiconductor chip includes a semiconductor substrate having a first surface and a second surface opposite to the first surface. An active layer is disposed in a portion of the semiconductor substrate adjacent to the first surface. A through electrode extends in the semiconductor substrate in a vertical direction. The through electrode has a lower surface connected to the active layer and an upper surface positioned at a level lower than a level of the second surface of the semiconductor substrate. A passivation layer is disposed on the second surface of the semiconductor substrate. A bonding pad is arranged on a portion of the passivation layer and the upper surface of the through electrode. The bonding pad has a cross-section with a 'T' shape in the vertical direction. The bonding pad is connected to the through electrode.

Growing community of inventors

Osan-si, South Korea

Wonkyun Kwon