Samsung Electronics Co., Ltd.

Soulbrain Co., Ltd.

Wonki Hur

Sanghyun Park

Seungho Park

Hyosan Lee

Sangkyun Kim

Hao Cui

Myeong Hoon Han

Inkwon Kim

Kyung-il Park

Yearin Byun

A slurry composition for a chemical mechanical polishing (CMP) process, the slurry composition including a first organic polishing booster including a quaternary amine group; a second organic polishing booster including an amino acid; and a carrier; wherein inorganic polishing particles are not included in the slurry composition or included in an amount of less than 0.01% by weight.

Slurry composition for chemical mechanical polishing

A polishing composition and a method of fabricating a semiconductor device using the same, the polishing composition including an abrasive; a first additive that includes a C5 to C30 hydrocarbon including an amide group and a carboxyl group or a C5 to C30 hydrocarbon including two or more amine groups; and a second additive that includes a sulfonic acid, a sulfonate, or a sulfonate salt.

Polishing composition and method of fabricating semiconductor device using the same

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Suwon-si, South Korea

Wonki Hur