Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Wonjin Cho

Dirk Tews

Markku Lager

Felix Tang

Michael Merschky

Martin Thoms

Norbert Lützow

Thomas Thomas

Fabian Michalik

Gabriela Schmidt

Toshio Honda

Valentina Belova-magri

Ting Xiao

Cedric Lin

Tatjana Königsmann

Mirko Kloppisch

Aaron Hahn

The present invention relates to a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material comprising as a main step contacting of at least one section of said metal, metal alloy or metal oxide with a specific azole silane compound, a specific azole silane oligomer, or a mixture comprising said compound and/or said oligomer. Furthermore, the present invention relates to a use of said specific azole silane compound, said specific azole silane oligomer, or said mixture in a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material.

Method for increasing adhesion strength between a metal and an organic material

The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps:

Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer

A method for manufacturing a printed circuit board, comprising in order steps (i) providing a non-conductive substrate having on a surface copper circuitry with a copper surface, wherein said surface is chemically treated by (a) oxidation and subsequent reduction reaction and/or (b) organic compound attached to said surface, a permanent, non-conductive, not fully polymerized cover layer covering at least partially said surface, (ii) thermally treating the substrate with the cover layer at temperature from 140&#xb0; C. to 250&#xb0; C. in atmosphere containing molecular oxygen at 100000 ppm or less, based on the total volume of the atmosphere, wherein a substrate with a permanent, non-conductive cover layer is obtained, with the provisos that (ii) is after (i) but before any metal or metal alloy is deposited onto the cover layer, and that in (ii) the cover layer is fully polymerized in one thermal treating step, if the cover layer is a solder mask.

Method for manufacturing a printed circuit board

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Berlin, Germany

Wonjin Cho