Samsung Electronics Co., Ltd.

Wonji Park

Jihyung Kim

Jeonghoon Ahn

Shaofeng Ding

JaeHee Oh

Jegwan Hwang

Yunki Choi

Jaehee Oh

Minguk Kang

A metal-insulator-metal capacitor includes a first electrode disposed in a first region of an upper surface of a substrate, a second electrode covering the first electrode and extending to a second region surrounding an outer periphery of the first region, a third electrode covering the second electrode and extending to a third region surrounding an outer periphery of the second region, a first dielectric layer disposed between the first electrode and the second electrode to cover an upper surface and a side surface of the first electrode and extending to the second region, and a second dielectric layer disposed between the second electrode and the third electrode to cover an upper surface and a side surface of the second electrode and extending to the third region and in contact with the first dielectric layer.

Metal-insulator-metal capacitor

A method of estimating warpage of an interposer and a method of manufacturing a semiconductor package by using the same are disclosed. The interposer includes a through electrode passing through a substrate, and a plurality of metal wiring layers and a plurality of insulating layers on the substrate, and the method of estimating warpage of an interposer includes: performing a temperature sweep test by using sample interposers, and measuring warpages according to temperatures; deriving a warpage slope, as a function of temperature, of each of the sample interposers; deriving a warpage model by linearly fitting the warpage slope with respect to an average pattern density of metal wiring layers in each of the sample interposers; and calculating a room temperature warpage reference value of the interposer based on the warpage model.

Methods of estimating warpage of interposers and methods of manufacturing semiconductor package by using the same

Growing community of inventors

Suwon-si, South Korea

Wonji Park