Samsung Electronics Co., Ltd.

Wonhyuk Hong

Rakhwan Kim

Eun-Ji Jung

Eui Bok Lee

Woojin Jang

Jongjin Lee

A semiconductor device includes transistors on a substrate, a first interlayered insulating layer on the transistors, first and second lower interconnection lines in an upper portion of the first interlayered insulating layer, and first and second vias on the first and second lower interconnection lines, respectively. Each of the first and second lower interconnection lines includes a first metal pattern. The first lower interconnection line further includes a second metal pattern, on the first metal pattern with a metallic material different from the first metal pattern. The second metal pattern is absent in the second lower interconnection line. The second via includes first and second portions, which are in contact with respective top surfaces of the first interlayered insulating layer and the second lower interconnection line, and the lowest level of a bottom surface of the second portion is lower than that of a bottom surface of the first via.

Semiconductor device having interconnection lines with different linewidths and metal patterns

A semiconductor device includes a transistor on a substrate, a first metal layer that is on the transistor and includes a lower wire electrically connected to the transistor, and a second metal layer on the first metal layer. The second metal layer includes an upper wire that is electrically connected to the lower wire and includes a via structure in a via hole and a line structure in a line trench. The via structure includes a via portion that is in the via hole and is coupled to the lower wire, and a barrier portion that vertically extends from the via portion to cover an inner surface of the line trench. The barrier portion is between the line structure and an insulating layer of the second metal layer. The barrier portion is thicker at its lower level than at its upper level.

Semiconductor devices and methods of fabricating the same

Semiconductor devices including via structures having a via portion and a barrier portion

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Seoul, South Korea

Wonhyuk Hong