Gem Services, Inc.

Wong Hie Ming

Hamza Yilmaz

Anthony Chia

LiMing Wang

Xiaoguang Zeng

Yiju Zhang

Singulation of individual electronic packages fabricated as part of a common matrix, is accomplished by mask patterning and chemical exposure in combination with physical sawing. In one embodiment of a singulation process in accordance with the present invention, an initial, shallow saw cut into inter-package regions of the matrix exposes underlying metal to subsequent chemical etching steps. In an alternative embodiment, a separate photoresist mask may be patterned over the matrix to selectively expose metal in inter-package regions to chemical etching.

Growing community of inventors

Singapore, Singapore

Wong Hie Ming