Samsung Electronics Co., Ltd.

Wondon Joo

Minhwan Seo

Jiyoung Chu

Hyungjin Kim

Jungchul Lee

Eunhee Jeang

Sangwoo Bae

Sungmin Ahn

Sangmin Lee

Taehyun Kim

Jiyoung Kim

Minseok Choi

Yunpyo Hong

Sungho Jang

Jeonggil Kim

Jungyu Lee

Ingi Kim

Seulgi Lee

Jinseob Kim

Gwangsik Park

Jongbin Park

Yoojin Jeong

Daehoon Han

Janghwi Lee

Ono Kazuya

Dohyun Jung

Anton Sofronov

Aleksandr Shorokhov

Anton Medvedev

Maksim Riabko

Boris Afinogenov

Dongyoon Koo

Matsuda Yozo

An extreme ultraviolet (EUV) collector inspection apparatus includes a light blocking cover covering a front surface of an EUV collector to be inspected and providing a space portion in which external light is blocked, a light source in the space portion, the light source having a pillar shape extending along a central axis of the EUV collector, the light source configured to output irradiated light ranging from an ultraviolet (UV) band to a visible light (VIS) band, and a spectrometer above the light source and configured to detect a spectrum of reflected light from the irradiated light reflected from the front surface of the EUV collector. The apparatus or a controller associated therewith may be configured to inspect a contamination state of the front surface of the EUV collector based on the spectrum of reflected light.

EUV collector inspection apparatus and inspection method

An optical apparatus includes a folding mirror configured to direct first and second illumination lights on first and second alignment marks respectively and reflect first and second reflected lights reflected from the first and second alignment marks in different horizontal directions respectively, first and second lenses arranged respectively in optical paths of the first and second reflected lights reflected from the first and second reflective surfaces of the folding mirror, first and second reflection portions configured to reflect the first and second reflected lights passing through the first and second lenses respectively, and a beam splitter prism configured to divide an illumination light incident through a first surface into the first and second illumination lights and direct to the first and second reflection portions, and transmit the first and second reflected lights reflected by the first and second reflection portions through a second surface.

Optical assembly for alignment inspection, optical apparatus including the same, die bonding system and die bonding method using the same

A method of bonding a die to a wafer using a die bonding system measures, using an obtained image showing interference fringes, a parallelism between the die and the wafer. In some embodiments, parallelism and die deformation are detected using interference fringes produced by an optical apparatus of the die bonding system. A parallelism measurement optical apparatus includes a light source, an optical assembly configured to control polarization of a reference light and a measurement light. In some embodiments, the measurement light is sequentially incident on and reflected from a first measurement surface and a second measurement surface that are spaced apart along a vertical direction to face each other, and is emitted to have information on parallelism between the first and second measurement surfaces. In some embodiments, a first polarizer is configured to interfere the reference light and the measurement light emitted from the optical assembly with each other. A light detector is configured to detect an interference signal of lights including the interference fringes.

Optical assembly for parallelism measurement, optical apparatus including the same, die bonding system and die bonding method using the same

Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.

Hyperspectral imaging (HSI) apparatus and inspection apparatus including the same

A substrate inspection apparatus includes a light source unit, a pulsed beam matching unit, a substrate support unit, an incidence angle adjusting unit, and a detecting unit. The light source unit emits a first laser beam having a first wavelength and a second laser beam having a second wavelength. The pulsed beam matching unit matches the first laser beam and the second laser beam to superimpose a pulse of the first laser beam on a pulse of the second laser beam in time and space. The substrate support unit supports a substrate to be inspected. The incidence angle adjusting unit adjusts angles of incidence of the matched first laser beam and second laser beams to irradiate the first laser beam and the second laser beam on the substrate, and mixes the first laser beam and the second laser beam to generate an evanescent wave on the substrate. The evanescent wave generates scattered light due to a defect of the substrate. The detecting unit detects the scattered light generated due to the defect of the substrate.

Substrate inspection system and method of manufacturing semiconductor device using substrate inspection system

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Incheon, South Korea

Wondon Joo