Samsung Electronics Co., Ltd.

Wonchul Lim

Sangwook Park

Jonggi Lee

Yonghoon Kim

Keung Beum Kim

Dongsuk Kim

A substrate includes a substrate body including a plurality of chip mounting regions and a peripheral region surrounding the plurality of chip mounting regions, each of the chip mounting regions including a conductive plane. The substrate further includes a conductive support structure located in the peripheral region, first conductive lines connected between the conductive planes of adjacent chip mounting regions, and second conductive lines connected between the conductive support structure and the conductive planes of chip mounting regions located adjacent the peripheral region.

Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the same

Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip having a bonding pad, a metal line electrically connected to the semiconductor chip and having a terminal contacting an external terminal, an insulation layer covering the metal line and having an opening that defines the terminal, and a molding layer molding the semiconductor chip, wherein the molding layer includes a recess pattern exposing the bonding pad and extending from the bonding pad to the terminal, and the metal line is embedded in the recess pattern to contact the bonding pad.

Semiconductor packages and methods of fabricating the same

Semiconductor packages

Growing community of inventors

Asan-si, South Korea

Wonchul Lim