Samsung Electronics Co., Ltd.

Wonchul Cho

Jungsoo Kim

Taeyun Kim

Wonjun Jeong

Kyeongeun Lee

Minki Cho

Dohyun Ahn

Kwangsic Choi

Yongwook Jang

Chonguk Heo

A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.

Camera module for heat dissipation and ground and electronic device including the same

A camera module according to an embodiment of the disclosure may include: a Printed Circuit Board (PCB), a first image sensor and a second image sensor disposed on the PCB, a lens holder having an upper plate facing and spaced apart from the PCB and a sidewall extending from an edge of the upper plate toward the PCB, wherein the upper plate includes a first through-hole and a second through-hole aligned to the first image sensor and the second image sensor, respectively, a first lens assembly including a first lens system and a first barrel accommodating the first lens system, and assembled to the first through-hole to be aligned with the first image sensor, and a second lens assembly including a second lens system and a second barrel accommodating the second lens system, and assembled to the second through-hole to be aligned with the second image sensor. The first barrel may include a first sidewall coupled to the first through-hole and a second sidewall having a greater diameter than the first sidewall and located between the first through-hole and the first image sensor. The second barrel may include a third sidewall coupled to the second through-hole and a fourth sidewall having a greater diameter than the third sidewall and located between the second through-hole and the second image sensor.

Camera module with reduced base line in dual camera and electronic device having the same

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Suwon-si, South Korea

Wonchul Cho