Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Won Young Lee

Taek Jung Lee

Jin Kyung Joo

Junghwan Choi

Jin Man Jung

Yongcheol Bae

Joon-Young Park

Yoon-Joo Eom

Sung Kwon An

Hyo Youn Lee

Joosun Choi

Seongjin Jang

Jae Yeol Choi

Younghak Oh

Yong Won Seo

Jin Woo Chun

Ik Hwan Chang

Doo Il Kim

Kangmoon Kim

Chang Sik Kim

Min Gon Lee

Junwon Lee

Jiyoung Kang

Chul Seung Lee

Seung Woo Song

Kyuok Choi

Yoonjung Choi

Bokeun Kim

Min Hee Hong

Hyeun Tea Yoon

Inkyeong Shin

Jaehyun Han

An electronic device is provided. The electronic device includes a communication module which can communicate with an electronic pen, and a processor, wherein the processor may determine the state of the electronic device, determine the state of the electronic pen, and, when the state of the electronic pen is determined that the electronic pen is attached to the electronic device and an input from the electronic pen is received through the communication module, perform a function related to the electronic pen based on the determined state of the electronic device.

Electronic device using electronic pen and method thereof

An operation method of a semiconductor device is disclosed. The semiconductor device includes separate first and second dies in a package and receives first types of signals through first and second respective channels independent of each other and corresponding to the first and second respective dies. The method includes a step in which when information for controlling internal operations of the first and second dies is first applied to the first die through a first pad, the first die performs the internal operation and also transmits the information to the second die through an internal interface connecting the first die and the second die, and a step in which when the information is transmitted to the second die, the second die performs the internal operation.

Multi channel semiconductor device having multi dies and operation method thereof

Various embodiments of the present disclosure relate to an electronic device and a method of processing a pop-up window using a multi-window thereof. The electronic device includes: a housing; a display viewable through a first face of the housing; a processor operatively coupled with the display; and a memory operatively coupled with the processor. The memory may store instructions which, when executed, cause the processor to control the electronic device to: in response to occurrence of an event, display a pop-up window including a first User Interface (UI) corresponding to the event in some regions of the display, detect an input requesting extending and displaying the pop-up window, identify whether a multi-window is active in response to the detection of the input, and based on the multi-window being active, remove the pop-up window and display a second UI for the event on a sub-window having a lowest priority among at least one sub-window other than a main window among the multi-windows.

Electronic device and method of processing pop-up window using multi-window thereof

A capacitor includes a body including a plurality of dielectric layers, first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, and first and second insulating regions. The first insulating region is disposed in each of the first internal electrodes and includes a first connection electrode disposed therein. The second insulating region is disposed in each of the second internal electrodes and includes a second connection electrode disposed therein. The products D1&#xd7;Td and D2&#xd7;Td are greater than 20 &#x3bc;m, where Td is a thickness of the dielectric layer, and D1 and D2 are widths of the first and second insulating regions, respectively.

Capacitor and board having the same

A capacitor component includes a plurality of unit laminates, each comprising a body with a stacked structure including a plurality of internal electrodes and connection electrodes that extend in a stacking direction of the body and electrically connect to the plurality of internal electrodes, and pad portions between adjacent unit laminates to electrically connect the respective connection electrodes of the unit laminates above and below the pad portions to each other.

Capacitor component

A capacitor component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode opposing each other in a first direction of the body with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction of the body, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction of the body, and first and second external electrodes disposed in the body and connected to the first and second internal electrodes, respectively. The body has edges having a rounded shape.

A multilayer capacitor includes a body including dielectric layers, and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, first and second groove parts formed in external surfaces of the body in a first direction in which the dielectric layers are stacked, having at least one corner, and contacting the first and second internal electrodes, respectively, and first and second connection electrodes disposed in the first and second groove parts, respectively, and electrically connected to the first and second internal electrodes, respectively.

Multilayer capacitor and board having the same

A multi channel semiconductor device is disclosed. The multi channel device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.

A capacitor component includes a body, a plurality of internal electrodes disposed in the body, connection electrodes extended in a thickness direction of the body and electrically connected to the plurality of internal electrodes, upper electrodes disposed on an upper surface of the body and electrically connected to the connection electrodes, and lower electrodes disposed on a lower surface of the body and electrically connected to the connection electrodes A thickness of the upper electrodes is different from that of the lower electrodes, and an area of contact between the upper electrodes and the body is different from an area of contact between the lower electrodes and the body.

A multi channel semiconductor device may include a substrate, a first die on the substrate and having a first channel to function as a first chip; and a second die on the substrate and having a second channel different from the first channel to function as a second chip and including the same storage capacity and physical size as the first die. An internal interface is disposed between the first and second dies. The internal interface is configured to transmit information for controlling internal operations of the first and second dies and first applied to a first recipient die of the first and second dies to the other die.

A multilayer capacitor includes a capacitor body including a dielectric layer and a first internal electrode and a second internal electrode; a first via electrode exposed through first and second surfaces of the capacitor body, connected to the first internal electrode and spaced apart from the second internal electrode, a second via electrode exposed through the first and second surfaces of the capacitor body, and connected to the second internal electrode and spaced apart from the first internal electrode, a first and second external electrodes disposed on the first surface of the capacitor body to be spaced apart from each other, and connected to the first and the second via electrodes, respectively, and first and second covers disposed in sequence from a bottom in the second surface of the capacitor body, wherein the first and second cover are formed of different materials.

Growing community of inventors

Suwon-si, South Korea

Won Young Lee