Samsung Electronics Co., Ltd.

Won-Young Chung

Tai-Kyung Kim

Keun-Ho Lee

Young-Nam Hwang

Young-Tae Kim

Hun-Jung Yi

Jong-won Kim

Sang-Oh Park

Jae-pil Shin

Ui-hui Kwon

Gyeong-Su Keum

Kyu-Baik Chang

Kwang-Ho Cha

Ho-Joon Lee

Ye-Ro Lee

Chang-Woo Kang

A method of detecting stress of an integrated circuit including first and second patterns formed from different materials may comprise: determining one or more stress detection points of the first pattern; dividing a region including a first stress detection point of the one or more stress detection points into a plurality of divided regions; calculating areas of the second pattern at the divided regions; and/or detecting a stress level applied to the first stress detection point of the first pattern by the second pattern based on the areas of the second pattern at the divided regions.

Methods of detecting stresses, methods of training compact models, methods of relaxing stresses, and computing systems

In a method of forming a phase-change memory device, a variable resistance member may be formed on a s semiconductor substrate having a contact region, and a first electrode may be formed to contact a first portion of the variable resistance member and to be electrically connected to the contact region. A second electrode may be formed so as to contact a second portion of the variable resistance member.

Phase-change memory device and method of manufacturing the same

A filament member configured to discharge thermions may be employed in an ion source of an ion implantation apparatus. A filament member may include an anode disposed around a central portion of the filament member, a cathode disposed around a periphery of the filament and/or enclosing the anode, and at least one conductive path disposed between the anode and the cathode to discharge the thermions.

Filament member, ion source, and ion implantation apparatus

A method an apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer are provided. In the apparatus for cleaning and drying a wafer, the wafer is dipped into a cleaning solution in a cleaning tank. The wafer is then dried using a drying gas in a drying chamber disposed over the cleaning tank. A shutter separates the cleaning tank from the drying tank. A wafer boat moves the wafer vertically between the cleaning tank and the drying tank. Nozzles for providing the cleaning solution onto the wafer are disposed at both inner sides of the drying tank. The nozzles are connected to a drying gas supply unit to alternately and periodically provide the drying gas onto the wafer.

Method and apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer

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Anyang-si, South Korea

Won-Young Chung