Samsung Electro-mechanics Co., Ltd.

Samsung Electronics Co., Ltd.

Sungkyunkwan University

Won Wook So

Young Sik Hur

Doo Il Kim

Yong Ho Baek

Jung Hyun Cho

Jung Chul Gong

Hak Sun Kim

Joo Yul Ko

Won Tae Choi

Jeongki Ryoo

Woncheol Lee

Young Kyu Park

Youngsik Hur

Young Kwan Lee

Nam Heung Kim

Keum Cheol Hwang

Dae Kwon Jung

Woo Jung Choi

Gilha Lee

Taegyu Ryu

Jin Su Park

Nam Ki Kim

Yun Tae Lee

Yong Duk Lee

Ho Kwon Yoon

Jin Seon Park

Jong Heum Park

Hyungjin Lee

Boo Dong Kwak

Yong-Serk Kim

Juhyoung Park

Daeki Lim

Kyung Hwan Ko

Dongok Ko

Jaemin Keum

Eunhyuk Kwak

Sung Eun Jo

Yong-serk Kim

YunJong Lee

Disclosed is a method of detecting a moving target by a target detecting apparatus. The method includes: acquiring radar data from a radar installed in a vehicle, extracting location coordinates of a moving target from the radar data, obtaining a line of a reflective surface on which a signal of the radar is reflected using location coordinates of a fixed object, determining whether the moving target is in a Line of Sight (LOS) area of the radar or in a Non Line of Sight (NLOS) area of the radar based on the location coordinates of the moving target and the line segment of the reflective surface, and based on determining that the moving target is in an area corresponding to the NLOS area of the radar, converting the location coordinates of the moving target into actual coordinates corresponding to an actual location of the moving target.

Method and apparatus with target detection

A method for detecting a moving target through a vehicle radar system includes acquiring radar data from a radar sensor disposed with respect to a vehicle, and using the radar data to detect a plane of a structure. The method also includes setting a reference classification line based on the detected plane, and determining whether the moving target is in a line of sight (LOS) area or a non-line of sight (NLOS) area based on the reference classification line.

Vehicle radar system and target detection

A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.

Printed circuit board assembly

An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.

Antenna module

An antenna apparatus includes: a ground plane including first sides parallel to a first direction and second sides parallel to a second direction, on a plane formed in the first and second directions; a dielectric layer disposed on the ground plane in a third direction; an antenna patch overlapping the ground plane in the third direction; and vias connected to the ground plane and passing through at least a portion of the dielectric layer. Edges of the vias at least partially overlap the first sides of the ground plane in the third direction.

Antenna apparatus

An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.

An antenna device is provided. The antenna device includes a first antenna patch configured to transmit and receive an RF signal in a first frequency bandwidth and disposed a first dielectric layer; a second antenna patch disposed on a second dielectric layer and coupled to the first antenna patch; a third antenna patch disposed on a third dielectric layer and coupled to the second antenna patch; and a fourth antenna patch configured to transmit and receive an RF signal in the second frequency bandwidth, wherein the second antenna patch includes a plurality of first sub-antenna patches that do not overlap the first antenna patch, and the third antenna patch includes a plurality of second sub-antenna patches that overlap the first sub-antenna patches.

Antenna device

An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.

Antenna substrate and antenna module including the same

An antenna apparatus includes a ground layer and an antenna patch overlapping via a dielectric layer therebetween, a first feed via and a second feed via penetrating at least a portion of the dielectric layer, a power supply line connected to the first feed via, and a coupling pattern disposed adjacent to the power supply line and coupled with the power supply line.

An antenna module includes: an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having at least one semiconductor chip embedded therein; and an electronic component disposed on the lower surface or a side surface of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The electronic component has a thickness greater than that of the semiconductor chip.

An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) package disposed on a first surface of the connection member; and an antenna package including a plurality of antenna members and a plurality of feed vias, and disposed on a second surface of the connection member, wherein the IC package includes: an IC having an active surface electrically connected to at least one wiring layer and an inactive surface opposing the active surface, and generating the RF signal; a heat sink member disposed on the inactive surface of the IC; and an encapsulant encapsulating at least portions of the IC and the heat sink member.

An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to at least one wiring layer; and an antenna package disposed on a second surface of the connection member, and including a dielectric layer, a plurality of antenna members, and a plurality of feed vias, wherein the antenna package further includes a chip antenna including a dielectric body and first and second electrodes, respectively disposed on first and second surfaces of the dielectric body, wherein the chip antenna is disposed to be spaced apart from the plurality of feed vias within the dielectric layer so that at least one of the first electrode or the second electrode is electrically connected to a corresponding wire of the at least one wiring layer.

A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.

Growing community of inventors

Suwon-si, South Korea

Won Wook So