Samsung Electronics Co., Ltd.

Samsung Led Co., Ltd.

Won Soo Ji

Sang Woo Ha

Tetsuo Ariyoshi

Ho Young Song

Choo Ho Kim

Kyung Mi Moon

Dae Seo Park

Oh Seok Kwon

Sung Jae Kim

Young Jin Cho

Hyun Kyung Kim

Yong Chun Kim

Jun Cheol Cho

Jong Sup Song

Hong Min Kim

Choo-ho Kim

Wook Hee Lee

Sung Min Yang

Min Hwan Kim

Beom Seok Shin

Jong Pil Won

Hun Yong Park

Won Ho Jung

Ka Ram Lee

Young Su Yun

Sung A Choi

Dae Kab Kwon

Chong Wook Cho

Sung Hoon Oh

Dae Gwan Kim

Ssang Gun Lim

Ju Hun An

Seung Gyu Ko

Sang Kyu Bang

Sung Don Kwak

Ju-Hun An

An optical device and a light source module including the same are provided. The optical device includes a first surface having an incident portion; a second surface emitting light incident through the incident portion outwardly; a support portion protruding from the first surface; and a blocking portion surrounding an outer portion of the support portion, the blocking portion being stepped with respect to the first surface.

Optical device and light source module including the same

A light source module includes a light source, a light guide plate on the light source and including at least one recess portion in an upper surface thereof, and a filter sheet on an upper surface of the light guide plate and having a pattern. The pattern may be configured to partially reflect and partially transmit light emitted from the light source through the light guide plate.

Light source module and lighting apparatus including the same

An optical device and a light source module including the same are provided. The optical device includes a first surface including an incident portion through which light that is emitted from a light source is incident, and a second surface through which the light incident through the incident portion is emitted. The incident portion may include a curved surface that is recessed toward the second surface, and a pointed vertex to which the curved surface is recessed, the pointed vertex being in a central portion of the optical device, and the central portion being through which an optical axis of the optical device passes.

There is provided a lens for a light emitter which includes: a bottom surface; an incident surface connected to the bottom surface at a central region of the bottom surface and disposed on or above a light source to allow light emitted from the light source to be made incident thereto and travel in an interior of the lens; and an output surface connected to the bottom surface at an edge of the bottom surface and configured to allow the light which has traveled in the interior of the lens to be emitted outwardly therefrom, wherein the central region of the bottom surface protrudes with respect to the other region of the bottom surface.

Lens for light emitter, light source module, lighting device, and lighting system

A light emitting device package is provided. The package includes a light emitting device including a substrate, and a light emitting structure having a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer stacked on the substrate; and a wavelength conversion film disposed in a path of light emitted by the light emitting device and having phosphor layers stacked on each other. A portion of the phosphor layers includes phosphor structures including a wavelength conversion material receiving light emitted from the light emitting device and converting a wavelength thereof and a binding resin binding the wavelength conversion material, and a transparent resin filling spaces between the phosphor structures.

Light emitting device package, wavelength conversion film, and manufacturing method thereof

An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.

Method for removing defective light emitting diode (LED) package from LED package arrary

A are provided a light source module. The light source module including a light emitting device configured to emit light in a light emitting direction; and an optical device including a first surface disposed over the light emitting device and having a groove recessed in the light emitting direction in a central portion through which an optical axis of the optical device passes, and a second surface disposed opposite to the first surface and configured to refract light incident through the groove to be emitted to the outside. The optical device includes a plurality of ridges disposed on the second surface and periodically arranged in a direction from the optical axis to an edge of the optical device connected to the first surface.

Light source module, lighting device, and lighting system

A method for inspecting a light source module for defects includes preparing a board on which a light emitting device and a lens covering the light emitting device are installed. A current is applied to the light emitting device to turn on the light emitting device. The lens is imaged with the light emitting device turned on. A central symmetry denoting a symmetry of light emission distribution from the center of the lens is calculated based on the obtained image, and the calculated central symmetry is compared with a reference value to determine whether unsymmetrical light emission distribution has occurred. Various other methods and apparatuses for inspecting light source modules are additionally provided.

Method of inspecting a light source module for defects, method of manufacturing a light source module, and apparatus for inspecting a light source module

An apparatus for measurement of a three-dimensional (3D) shape includes a lens unit transmitting slit beams to a plurality of measurement objects, a light source unit irradiating the plurality of slit beams to the lens unit at different angles, an imaging unit obtaining images of the plurality of measurement objects formed by the slit beams irradiated on the plurality of measurement objects, and a calculation processing unit generating information regarding a 3D shape of the plurality of measurement objects from the images obtained by the imaging unit.

Apparatus for measurement of three-dimensional shape

A light emitting diode (LED) inspection apparatus includes at least one LED including a phosphor applied on an emission surface, a first lighting unit to emit visible light to the LED, a second lighting unit to emit ultraviolet (UV) light to the LED, a photographing unit to generate at least one first image data by photographing the visible light reflected from the LED and to generate at least one second image data by photographing the UV light reflected from the LED, and a determination unit to determine a defect in appearance and emission characteristics of the LED using the at least one first image data and second image data.

Apparatus for inspecting light emitting diode and inspecting method using said apparatus

An apparatus for inspecting a light emitting diode (LED) package is provided to inspect an LED to determine whether or not it is defective, and discard the LED when the LED is defective. The apparatus for inspecting an LED package includes: an inspection unit inspecting an LED through a visual inspection to determine whether or not the LED is defective; and a defective product rejection unit discarding the LED when the LED is determined to be defective on the basis of inspection results from the inspection unit among LEDs supplied from the inspection unit. Because the operation of inspecting LEDs and discarding a defective LED are automated and can be rapidly processed as a sequential process, productivity can be improved.

Apparatus for inspecting light emitting diode package and inspecting method using the same

There is provided a slit valve unit including: a body disposed on an outer side of a process chamber and having an entrance connected to an opening of the process chamber; a slit valve provided in an internal space of the body and selectively opening and closing the entrance; a plurality of packing members provided along the circumference of the entrance on an inner side of the body and tightly attached to the slit valve when the slit valve shields the entrance; and a connection pipe having one end exposed between the plurality of packing members on the inner side of the body so as to be connected to an airtight space formed among the plurality of packing members, the body, and the slit valve, and the other end exposed to the outer side of the body, the connection pipe penetrating the body.

Slit valve unit and film forming apparatus having the same

A side-view type light emitting device includes a package body, a lead frame, and a light emitting diode (LED). The package body has a first surface provided as a mount surface, a second surface disposed on a side opposite to the first surface, and lateral surfaces disposed between the first surface and the second surface. The package body includes a recessed portion disposed on a lateral surface corresponding to a light emitting surface of the lateral surfaces. The lead frame is disposed in the package body. The LED chip is mounted on a bottom surface of the recessed portion. Protrusion parts protruding toward the LED chip are disposed in regions adjacent to the LED chip of facing inner sidewalls of the recessed portion, respectively.

Side-view type light emitting device and line light source type light emitting device

There is provided an LED testing apparatus. An LED testing apparatus according to an aspect of the invention may include: a first lighting unit generating first light and irradiating the first light onto an LED having an encapsulant including a fluorescent material excited by the first light to emit light having a longer wavelength than the first light; a second lighting unit generating second light having a longer wavelength than the first light to irradiate the second light onto the LED; an image acquisition unit receiving the light emitted from the fluorescent material and the second light reflected off the LED to acquire images of the LED; and an LED state determination unit determining whether the LED is acceptable or defective using the images of the LED acquired by the image acquisition unit.

LED testing apparatus and testing method thereof

A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface.

Growing community of inventors

Hwaseong-si, South Korea

Won Soo Ji