Lg Innotek Co., Ltd.

Won Seob Shin

Jong Ha Park

Dae Hee Lee

Woong Hwang

Tae Young Kim

Ga Young Hong

An embodiment comprises a lens driving part including a lens, a connection substrate connected to the lens driving part, and a connector part connected to the connection substrate. The connector part comprises a substrate including, on the upper surface thereof, a cavity and a ground layer, a noise shield part located within the cavity of the substrate and contacting the ground layer, and a reinforcement member located on the noise shield part. The reinforcement member is located in the cavity of the substrate and on the upper surface of the substrate. In a top view, the length of one side of the noise shield part is less than the length of one side of the cavity of the substrate.

Camera module and optical device including same

A camera module according to an embodiment includes a circuit board; a protrusion disposed on the circuit board; an adhesive member disposed on the circuit board and including an opening vertically overlapping the protrusion; and a sensor base disposed on the adhesive member and including a concave portion vertically overlapping the protrusion, wherein the protrusion is inserted into the concave portion of the sensor base, and wherein the adhesive member has a closed loop shape surrounding an edge region of an upper surface of the circuit board.

Camera module and optical device comprising same

A camera module according to an embodiment includes a reinforcing plate; a substrate disposed on the reinforcing plate; a lens driving unit disposed on the substrate; and an adhesive layer disposed between the reinforcing plate and the substrate, wherein the substrate includes a first cover layer including a plurality of holes; and a circuit pattern layer disposed on the first cover layer; wherein the adhesive layer is adhered contacts the circuit pattern layer through the plurality of holes.

Camera module

A camera module according to an embodiment includes a reinforcing plate; a bump part disposed on the reinforcing plate; a substrate disposed on the reinforcing plate and including a cavity vertically overlapping the bump part; and an image sensor disposed on the bump part, wherein the bump part includes a first bump disposed on the reinforcing plate and having a first height; and a second bump disposed on the first bump and having a second height different from the first height; and wherein an upper surface of the second bump is in direct contact with a lower surface of the image sensor.

Camera module including an image sensor

A protective sheet according to an embodiment includes an optical film layer; and an adhesive layer disposed on one surface of the optical film layer and including a first open region; wherein an outer width of the optical film layer is greater than an outer width of the adhesive layer, wherein a central region of the one surface of the optical film layer is exposed through the first open region of the adhesive layer, and an outer region of the one surface of the optical film layer is exposed by a difference from the outer width of the adhesive layer.

Protective sheet and camera module comprising same

A camera module according to an embodiment includes a circuit board; and an image sensor disposed on the circuit board; wherein the circuit board includes: an insulating layer; a pad disposed on the insulating layer; a terminal disposed on the insulating layer and spaced apart from the pad; a protective layer disposed on the insulating layer and including an opening exposing the pad and the terminal; a wire part disposed on the pad; and a connecting wire connecting the image sensor and the terminal, wherein a lower surface of the image sensor is in direct contact with the wire part, and wherein the wire part and the image sensor are electrically separated from each other.

Growing community of inventors

Seoul, South Korea

Won Seob Shin