Samsung Electronics Co., Ltd.

Won-Sang Choi

Bo-un Yoon

Sang-Jine Park

Jeong-Nam Han

Kee-Sang Kwon

Ha-Young Jeon

Doo-Sung Yun

Yeon-Jin Gil

Ji-Won Yun

Chan-ho Park

Jeong-Kil Lee

Nam-Ki Cho

A chemical supplier includes a chemical reservoir containing a chemical mixture at a room temperature, an inner space of the chemical reservoir being separated from surroundings, a supply line through which the chemical mixture is supplied to a process chamber from the chemical reservoir, an inline heater positioned on the supply line and heating the chemical mixture in the supply line to a process temperature, and a power source driving the chemical mixture to move the chemical mixture toward the process chamber.

Chemical supplier, processing apparatus including the chemical supplier

Semiconductor devices are provided. A semiconductor device includes a fin protruding from a substrate. Moreover, the semiconductor device includes first and second gate structures on the fin, and an isolation region between the first and second gate structures. The isolation region includes first and second portions having different respective widths. Related methods of forming semiconductor devices are also provided.

Semiconductor devices including an isolation layer on a fin and methods of forming semiconductor devices including an isolation layer on a fin

Provided is a method of fabricating a semiconductor device. The method of fabricating a semiconductor device includes preparing a substrate in which a scribe lane region and a chip region are defined, forming a trench in the scribe lane region of the substrate, forming a stopper layer in a part in the trench, and forming an alignment mark material on the stopper layer.

Semiconductor device and method of fabricating the same

A method of fabricating a semiconductor device, the method including forming on a substrate a transistor that includes a gate electrode and a source and drain region, forming an interlayer insulating film on the transistor, forming a contact hole in the interlayer insulating film to expose a top surface of the source and drain region, and a thin film is formed at an interface between the contact hole and the exposed top surface of the source and drain region. The method further including selectively removing at least a portion of the thin film by performing an etching process in a non-plasma atmosphere, forming an ohmic contact film on the source and drain region where at least a portion of the thin film was selectively removed, and forming a contact plug by filling the contact hole with a conductive material.

Method of fabricating semiconductor device

Growing community of inventors

Seoul, South Korea

Won-Sang Choi