Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Won Myoung Ki

Jin Han Kim

Dong Jin Kim

Do Hyung Kim

Curtis Michael Zwenger

Jun Hwan Park

Ji Hun Lee

Jae Hun Bae

Hyun Cho

Seung Nam Son

Won Chul Do

In Su Mok

Tae Kyeong Hwang

Won Geol Lee

Il Bok Lee

Soo Hyun Kim

Jin Young Kim

Seung Jae Lee

Sung Kyu Kim

Se Woong Cha

Yoon Joo Kim

Shaun Bowers

Dong Hoon Han

George Scott

Jae Hun Bae Bae

Won Chul Do Do

In one example, an electronic device comprises a substrate comprising a conductive structure and a dielectric structure, the dielectric structure comprising an upper dielectric layer, an electronic component over a top side of the substrate and coupled with the conductive structure, an encapsulant over the top side of the substrate and adjacent a lateral side of the electronic component, and a shield over the top side of the electronic component and contacting a lateral side of the encapsulant and a first lateral side of the substrate. The conductive structure comprises a first tab structure at the first lateral side of the substrate, and wherein the first tab structure contacts the shield and extends above the upper dielectric layer. Other examples and related methods are also disclosed herein.

Electronic devices and methods of manufacturing electronic devices

In one example, an electronic device includes an electronic component including a component first side, a component second side opposite to the component first side, and a component lateral side connecting the component first side to the component second side, wherein the component lateral side defines a perimeter of the electronic component. A first intermediate terminal is coupled to the electronic component within the perimeter. An intermediate component is coupled to the first intermediate terminal within the perimeter. An encapsulant structure is over the intermediate component, at least a portion of the first intermediate terminal, and at least a portion of the electronic component. Other examples and related methods are also disclosed herein.

In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.

Semiconductor device and method of manufacturing a semiconductor device

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

Semiconductor device and manufacturing method thereof

A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers on an upper surface and a lower surface of the molding compound resin except where redistribution layers are formed on upper and lower surfaces of the molding compound resin, and a metal pattern on a lower surface of the transparent fiducial die that is visible through an exposed upper surface of the transparent fiducial die. The pattern may comprise a standard coordinate for forming a through mold via utilizing laser drilling.

Wafer level fan-out package with a fiducial die

Growing community of inventors

Anyang-si, South Korea

Won Myoung Ki