University of Illinois

Northwestern University

Advanced Diamond Technologies, Inc.

Won Mook Choi

John A Rogers

Heung Cho Ko

Mark Stoykovich

Yonggang Huang

Matthew Alexander Meitl

Etienne Menard

Jong Hyun Ahn

Dae Hyeong Kim

Ralph G Nuzzo

Yugang Sun

Dahl-Young Khang

Zhengtao Zhu

Hanqing Jiang

Andrew Evert Carlson

Jizhou Song

Keon Jae Lee

John Arthur Carlisle

Hoon-sik Kim

Seong Jun Kang

Tae Ho Kim

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.

Stretchable and foldable electronic devices

Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

Printable, flexible and stretchable diamond for thermal management

Growing community of inventors

Champaign, IL, United States of America

Won Mook Choi