Other

Amkor Technology, Inc.

Anam Semiconductor Inc.

Won Kyun Lee

Won Sun Shin

Seon Goo Lee

Choon Heung Lee

Jun Young Yang

Tae Hoan Jang

Won Dai Shin

Chang Hoon Ko

A circuit board for semiconductor package is designed to provide a complete grounding with corresponding equipment in the manufacture of the semiconductor package based on a circuit board, thereby preventing a breakdown of the circuit board or semiconductor chip caused by electrostatic charges. The printed circuit board for semiconductor package includes: a resinous substrate; a chip mounting region formed on the top surface of the resinous substrate for mounting a semiconductor chip thereon; a plurality of fine circuit patterns radially disposed in the circumference of the chip mounting region and extending to the edge of the chip mounting region; a plurality of ball lands formed in an array on the bottom surface of the resinous substrate, to be fused to conductive balls; a conductive via hole connecting the circuit patterns on the top surface of the resinous substrate to the ball lands on the bottom surface of the resinous substrate; a cover coat applied to the top and bottom surfaces of the resinous substrate to protect the circuit patterns from an external environment and make the ball lands open to the exterior; and a means for removing electrostatic charges provided at the edge of the substrate and connected to the plural circuit patterns to remove electrostatic charges in the manufacture of semiconductors.

Circuit board for semiconductor package

A semiconductor package provided with a heat sink adapted to discharge heat from the package. The package has an oxidation film formed on an upper surface portion of the heat sink to which a semiconductor chip is attached, thereby improving the bonding between the semiconductor chip and heat sink to prevent the occurrence of an interface peel-off and the formation of cracks. This results in an improvement in reliability. A silver layer or a double layer consisting of a nickel layer and a palladium layer formed over the nickel layer is plated on the remaining upper surface portion of the heat sink not attached with the semiconductor chip. Accordingly, it is also possible to achieve easy ground bonding and power bonding. This results in an improvement in performance of the finally produced semiconductor package.

Semiconductor package including heat sink with layered conductive plate

Growing community of inventors

Seoul, South Korea

Won Kyun Lee