Samsung Display Co., Ltd.

Won-Kyu Lim

Hyun-Chul Lee

Cheol-Lae Roh

Jae-Seok Park

Yong-Jin Lee

Jang-Hwan Shin

Jin-Han Park

Joon-Hyung Kim

Ji-Hyeon Kang

Hyung-Sik Kim

Alexander Voronov

A substrate cutting apparatus includes a stage configured to support a substrate, a first laser generator configured to emit a first laser beam toward the substrate, the first laser beam being a short-pulse laser beam, and a beam swing unit disposed on a beam path of the first laser beam, the beam swing unit being configured to swing the first laser beam in a predetermined light irradiating section on the substrate, the light irradiating section on the substrate including at least one of a curved line section and a straight line section.

Substrate cutting apparatus and method for cutting substrate using the same

A substrate cutting apparatus for cutting a large size substrate into smaller unit substrates includes a rotating table and a push plate. The rotating table, on which the large size substrate having formed thereon a plurality of cutting lines is mountable, includes rotating shafts at locations corresponding to the cutting lines. The push plate fixes a position of the large size substrate on the rotating table.

Method and apparatus for cutting a substrate

An organic light-emitting display device includes a first substrate including an organic light-emitting diode and a plurality of electrodes connected to the organic light-emitting diode, the plurality of electrodes extending on the first substrate along a first direction toward an edge of the first substrate, a second substrate connected to the first substrate, the second substrate being shorter than the first substrate and exposing a portion of the plurality of electrodes on the first substrate, a sealing material disposed between the first substrate and the second substrate to surround the organic light-emitting diode, and an electrode protecting layer partially covering the exposed portion of the plurality of electrodes on the first substrate, a first side of the electrode protecting layer being between the first substrate and the second substrate, and a second side of the electrode protecting layer protruding beyond the second substrate.

Organic light-emitting display device and method of manufacturing the same

An apparatus for removing a protective film for a flat display panel includes a laser oscillating member configured to be disposed over the protective film, the protective film attached to a surface of the flat display panel, the laser oscillating member configured to cut the protective film into a plurality of division regions by irradiating a laser beam; a separation member configured to peel at least one of the plurality of division regions from the flat display panel; a spacer member configured for insertion between the protective film and the at least one division region to be peeled from the flat display panel; and an adhesive member configured for attachment to a surface of the division region opposite the spacer member on the division region, the spacer member and the adhesive member being configured to move in a same direction.

Method and apparatus for peeling protection film for flat display panel

A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.

Laser cutting method and method of manufacturing organic light-emitting device

A method of manufacturing a flat panel display is disclosed. In one aspect, the method includes preparing first and second mother substrates, forming a plurality of display cells on at least one of the mother substrates, forming a plurality of sealant lines enclosing the respective cells on either one of the mother substrates and assembling and sealing the two mother substrates with the sealant lines interposed therebetween. The method also includes mounting the two mother substrates on a stage, irradiating a laser beam to a defined light irradiation region of the mother substrates and cutting the mother substrates while moving the light irradiation region along an imaginary cut line where the mother substrates are to be cut. The light irradiation region includes a linear region and a curved region.

Flat panel display and manufacturing method thereof

A flat panel display is disclosed. In one embodiment, the display includes i) a first substrate including a display area, wherein at least one display element is formed in the display area, ii) a second substrate covering the display area and connected to the first substrate, iii) a sealant formed between the first and second substrates. In one embodiment, the first substrate and the second substrate comprise a first cut surface and a second cut surface, respectively. Further, each of the first cut surface and the second cut surface has a plurality of corners each of which is concave from the perspective of the display area.

A substrate cutting method includes the steps of aligning a panel including two or more substrates, along a cutting line, forming groove lines in the respective substrates of the panel along the cutting line, by oscillating respective ultraviolet UV laser beams along the cutting line, and cutting the panel along the groove lines, by applying force to the panel.

Method of cutting substrate

A method of forming a pattern and a method of manufacturing an organic light emitting device, the method of forming a pattern including providing an electromagnetic substrate for generating an electromagnetic field at a selectively controllable position by selectively controlling where current flows through the electromagnetic substrate; providing a patterning substrate for forming a pattern; aligning the electromagnetic substrate to a first surface of the patterning substrate; selectively applying current to the electromagnetic substrate to form the electromagnetic field at the predetermined position; providing masking powder in a vicinity of a second surface of the patterning substrate such that the masking powder reacts to the electromagnetic field; supplying a pattern forming material to the second surface of the patterning substrate; and cutting off the current to the electromagnetic substrate.

Method of forming pattern and manufacturing method of organic light emitting device

A laser induced thermal imaging (LITI) method, a method of patterning an organic layer using the same and a method of manufacturing an organic light emitting diode (OLED) display device using the same. The LITI method includes preparing a substrate including a transfer layer, preparing a donor substrate including a base film and a light-to-heat conversion layer disposed on the base film, aligning the substrate with the donor substrate, and irradiating laser to the base layer of the donor substrate. Here, the laser is irradiated to the base layer in a region excluding a region corresponding to a pattern to be formed on the substrate. Thus, according to the method, regardless of the size of the pattern to be formed and the size of the laser beam, stitching mura can be prevented.

Laser induced thermal imaging method, method of patterning organic layer using the same and method of fabricating organic light emitting diode display device using the same

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Yongin, South Korea

Won-Kyu Lim