Samsung Electronics Co., Ltd.

Seoul National University

Won-ki Park

Jang-hyoun Youm

Jong-hwi Seo

Young-il Jang

Ho-youl Lee

Jong-Hyun Choi

Byoung-Tak Zhang

Kyoung-whan Oh

Jae-Hyuk Choi

Kyoung-Whan Oh

Seong-Ho Choi

Yong-Won Choi

Seok-Bae Moon

Won-Yup Ko

Yeon-Woo Choi

Ha-nock Kwak

An equipment diagnosis system and method, which use abnormal data and normal data of equipment and accurately and effectively perform diagnosis on the equipment, are provided. The equipment diagnosis system includes a data acquisition unit to acquire time series data of equipment, a preprocessing unit convert the time series data into frequency data including a temporal component through a Fourier transform, a deep learning unit to perform deep learning through a convolution neural network (CNN) by using the frequency data, and a diagnosis unit to determine a state of the equipment to be a normal state or a breakdown state based on the deep learning.

Equipment diagnosis system and method based on deep learning

A method of inspecting a wafer quality includes injecting ions into a wafer using an ion beam in an ion implantation process, collecting data about the ion beam by using a Faraday cup, extracting first data from the data about the ion beam, extracting a wafer section from the first data, calculating a feature value of a wafer from the wafer section, and evaluating a quality of the wafer by comparing the feature value with a predetermined threshold or range.

Wafer quality inspection method and apparatus, and semiconductor device manufacturing method including the wafer quality inspection method

A method for determining a position of a fault of equipment includes receiving a plurality of sound source signals from a plurality of sound source inputting apparatuses, determining an abnormal operation of the equipment by analyzing at least one sound source signal among the sound source signals, and extracting abnormal sound source signals from the sound source signals. The abnormal sound source signals are indicative of abnormal operation of the equipment. The method further includes determining a position of the abnormal operation based on a time difference between the abnormal sound source signals.

Method of determining position of fault of equipment using sound source inputting apparatus and system of determining position of fault of equipment for performing the same

A heat dissipation system for a semiconductor device having a plurality of semiconductor chips, includes a heat dissipation member which cools the semiconductor chips, an exterior heat dissipation member which is provided opposite to the heat dissipation member, engaged to the semiconductor device and connected to an electrical ground, an electric conductor member which is provided between the heat dissipation member and the exterior heat dissipation member, and electrically connects the heat dissipation member and the exterior heat dissipation member to each other, and a thermal conductivity insulating member which is inserted between the heat dissipation member and the exterior heat dissipation member. Accordingly, the resistance against common mode noise is increased. Furthermore, the heat dissipation efficiency of the semiconductor device is also increased. The head dissipation system improves the heat dissipation efficiency of the semiconductor device to control noise.

Heat dissipation system for semiconductor device

A motor power supply having an inrush current protection mode, a motor drive mode, an overvoltage protection mode, and a dynamic braking mode. In the inrush protection mode, a first resistance limits an inrush current to a capacitor which smoothes a rectifier output to provide DC power to an inverter during the motor drive mode. In the overvoltage protection mode, the first resistance is used in conjunction with a switching element to controllably discharge an overvoltage which may occur across the capacitor due to regenerated energy from the motor passing back through the inverter. During the drive mode, the inverter input is connected with the DC power and during the dynamic braking mode, the inverter input is connected with a second resistance which dissipates the energy regenerated by the motor. A controller controls a multi-contact relay and the switching element to implement the various modes of operation.

Motor power supply

Growing community of inventors

Seoul, South Korea

Won-ki Park