Hyundai Motor Company

Suzhou Lekin Semiconductor Co., Ltd.

Lg Innotek Co., Ltd.

Lg Hausys, Ltd.

Kia Motors Corporation

Kia Corporation

Postech Academy-industry Foundation

Other

Korea Advanced Institute of Science and Technology

Korea Institute of Science and Technology

Yonsei University

Solarceramic Co., Ltd.

Won Jung Kim

Chang Man Lim

Sang Hak Kim

June O Song

Ki Seok Kim

Mi Yeon Song

Yong Jun Jang

Ki Chun Lee

In Woo Song

Ji Yong Lee

Myung Shin Lee

Bong Kul Min

Hyoung Jin Kim

Yong Kim

Yong Doo Son

Sol Kim

Tae Young Kim

Jinwoo Lee

Hoon Mo Park

Kyung Moon Lee

Dong Hoon Nam

Ji Hye Park

Jong Eun Kim

Tae Hee Lee

Chang Wook Lee

Jun Young Kim

Na Young Kim

Myung Ho Lee

Jiwon Lim

Seongmoon Jung

Dayoung Yu

Sang Hyun Rho

Dongmin Song

Yong-Gu Kim

Ju Hee Lee

Moon Jung Eo

Ho Young Chung

Young Jin Cho

Byeong Soo Shin

You Jung Song

Sung Geun Park

Ji Hoon Lee

Hyun Bae Dong

In Sun Song

Hae Yoon Jung

Kwang Suck Suh

Seonggyu Lee

Suk Hoon Hong

Woong Hee Lee

Eun Young Lee

Jong Hyun Jang

Jin Young Hwang

Hyun Seo Park

Jung Hwa Jung

Se Hwan Jo

Han Sung Kim

Bum Joon Kim

Hoo Sang Park

Min Jae Chai

Sang Jun Lee

Tae Sung Lee

Jun Seok Seo

Yeon Sik Jung

Bong Uk Bae

Jun Tae Kim

Young Shin Kim

Yong Sung Lee

Kyung Moo Lee

Ju Ahn Park

Min Kyung Cho

Hyun Jeong Kim

Min Sik Kim

Chul Kyu Song

Yong Man Jang

Young Kwon Kim

Ju Hae Jung

Jung Tak Kang

Seung Koo Shin

Yeong June Lee

Nak Hun Kim

Ki Ung Jeon

Heung Ju Lee

Sung Jun Lim

Myung Su Lim

Suk Kyung Park

Youjung Song

A hydrogen storage system is disclosed and includes a storage unit including a plurality of unit storage containers, in which metal hydride materials are respectively provided in an interior thereof and which are connected to each other in parallel, and a thermal fluid line defining a thermal fluid passage, which passes via the plurality of unit storage containers continuously and through which a thermal fluid flows for heating or cooling the unit storage containers, thereby enhancing a storage performance and an efficiency of the hydrogen.

Hydrogen storage system

A hydrogen storage device includes a storage container having an accommodation space in an interior thereof, a first metal hydride material provided in the interior of the storage container and that stores hydrogen, and a second metal hydride material provided in the interior of the storage container and that stores the hydrogen at a pressure that is different from that of the first metal hydride material. An advantageous effect of restraining an excessive rise of a pressure of the storage container and enhancing safety and reliability may be obtained.

Hydrogen storage device

A device for controlling a line connection type fuel cell system and a method for the same are provided. The device for controlling a line connection type fuel cell system includes a plurality of fuel cell modules, an Alternating Current (AC) voltage generator, and a controller to activate the AC voltage generator to generate an AC voltage corresponding to power supplied from a system, and to control the plurality of fuel cell modules to generate a current in synchronization with the AC voltage.

Device for controlling line connection type fuel cell system and method for the same

The present invention relates to a sandwich panel and a method of manufacturing the same. The sandwich panel according to the present invention has high density and improved physical properties such as flexural strength, flexural modulus, bending strength and lightening weighting ratio and is suitable for use in various consumer products or industrial materials.

Sandwich panel and a manufacturing method thereof

A light-emitting element package according to an embodiment comprises: a body comprising a cavity; the cavity; a first frame and a second frame arranged on the bottom surface of the cavity; a first metal layer disposed on the first frame; an ultraviolet light-emitting element disposed on the first metal layer; and a second metal layer disposed on the second frame and electrically connected to the second frame, wherein the body comprises a separation portion between the first frame and the second frame, the second metal layer extends over the sloping surface of the cavity and the separation portion of the body, and the second metal layer is spaced apart from the first metal layer in the cavity and surrounds the first metal layer.

Light-emitting element package and light source module

A fuel cell recovery control system and method are provided to supply hydrogen to the cathode of a fuel cell stack to remove an oxide film formed on a platinum surface of the cathode. The performance of the fuel cell stack is recovered in accordance with the oxide film removal. In addition, electric power generated during the performance recovery of the fuel cell stack is consumed in an inverter and, as such, overcharge of a battery is prevented.

Fuel cell recovery control system and method

A light-emitting device package according to one embodiment comprises: a body including a through-hole formed in an upper surface and a lower surface; a light-emitting device arranged on the upper surface of the body and including first and second bonding units spaced apart from each other; and first and second metal units arranged so as to be spaced apart from each other on the rear surface of the body, wherein a partial area of each of the first and second bonding units overlaps with the through-hole in a vertical direction, the first and second metal units respectively includes first and second extension portions extending to the through-hole; the first and second extension portions is electrically connected to the first and second bonding units, respectively; and the first and second extension portions face each other within the through-hole.

Light-emitting device package and light source module

The light emitting device package disclosed in the embodiment includes a first frame having a first through hole; a second frame having a second through hole; a body disposed between the first and second frames; and light emitting devices disposed on the first and second frames, wherein the first and second through holes have an area of a lower surface larger than an area of the upper surface, and centers of the upper and lower surfaces of the first through hole may be offset from each other in the vertical direction, and centers of the upper and lower surfaces of the second through hole may be offset from each other in the vertical direction.

Light emitting device package and light source device

An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, a light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.

Light emitting device package and lighting apparatus having same

A light emitting device package according to an embodiment may include: a first frame including a first opening passing through upper and lower surfaces, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers disposed in the first and second openings, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on the first resin. According to an embodiment, the light emitting device may include a first bonding part electrically connected with the first frame and a second bonding part spaced apart from the first bonding part and electrically connected with the second frame, and the first and second bonding parts may be disposed on the first and second openings, respectively. According to an embodiment, the first and second frames may include first and second metal layers having third and fourth openings passing through upper and lower surfaces around the first and second openings, respectively, and widths of the first and second bonding parts in a horizontal direction may be greater than widths of upper surfaces of the first and second openings in the horizontal direction.

Light emitting device package

Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.

The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.

The light emitting device package disclosed in the embodiment includes a package body including first and second frames, and a first body disposed between the first and second frames; a second body disposed on the package body and including a cavity and a sub-cavity spaced apart from the cavity; a light emitting device disposed in the cavity and including first and second bonding portions; and a protection device disposed in the sub-cavity, wherein the package body and the second body may be coupled to an adhesive member.

Light-emitting device package and lighting source device

A light emitting device package according to an embodiment may comprise: a first package body including a first and a second opening; a light emitting device disposed on the first package body and including a first and a second bonding part; and a first resin disposed between the first package body and the light emitting device. The light emitting device may comprise one surface on which the first and second bonding parts are disposed, the first bonding part may comprise a first side surface and a lower surface facing the first package body, and the second bonding part may comprise a second side surface opposite to the first side surface, and a lower surface facing the first package body. The first resin may comprise an upper surface disposed on the one surface of the light emitting device, a third side surface extending from the upper surface to the lower surface of the first bonding part along the first side surface of the first bonding part, and a fourth side surface extending from the upper surface to the lower surface of the second bonding part along the second side surface of the second bonding part.

A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.

Light-emitting device package and lighting device having same

Growing community of inventors

Seoul, South Korea

Won Jung Kim