Lg Innotek Co., Ltd.

Won Jin Son

Tae Young Choi

Sung Ho Kim

Dong Nyung Lim

Seung Yeon Lee

Cheon Joo Kim

Jung Ha Hwang

Bong Kul Min

Chung Hee Ryu

Won Bong Lee

Seoung Yeon Lee

A light emitting device package is provided. The light emitting device package may include a frame, a first lead frame spaced apart from the frame, a second lead frame spaced apart from the frame, a body coupled to the frame and the first and second lead frames and having a first cavity, and a plurality of light emitting devices on the frame exposed through the first cavity. The body may include a reflective part provided inside the first cavity to surround at least one of the light emitting devices, thereby improving light extraction efficiency.

Light emitting device package and lighting device having the same

A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.

Light emitting apparatus and light emitting unit

A lighting device comprises: a heat sink which comprises one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and comprises a substrate and a plurality of light sources disposed on the substrate, wherein the substrate has a first hole disposed at the center thereof and a second hole; a power controller which is electrically connected to the light emitting module through the second hole of the substrate and is disposed in the receiving recess of the heat sink, wherein the light emitting module comprises a first light emitting module comprising a first substrate and a first light source, and a second light emitting module comprising a second substrate and a second light source, wherein the first substrate and the second substrate are disposed adjacent to each other.

Lighting device

A light emitting device package may be provided that includes: a package body which includes a first cavity and a second cavity which are formed to be depressed in at least a portion of the package body; a first light emitting device and a second light emitting device, each of which is disposed in the first cavity and the second cavity respectively; and a first fluorescent substance and a second fluorescent substance, each of which is filled in the first cavity and the second cavity respectively.

A lighting device may be provided that includes a heat sink which includes one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and includes a substrate and a plurality of light sources disposed on the substrate, wherein the substrate includes a hole and a plurality of via-holes; a power controller which includes an electrode pin electrically connected to the light emitting module through the via hole; and aninsulating inner case which receives the power controller therein and is disposed in the receiving recess of the heat sink, wherein the light sources include an lighting emitting diode.

Provided are a light emitting apparatus and a light unit. The light emitting apparatus comprises a first substrate, a second substrate, and a light emitting device. The first substrate has a plurality of lead frames, and the second substrate has an opening part on the first substrate. The light emitting device is mounted on a portion of the first substrate that is below the opening part. The light unit comprises at least one light emitting apparatus and an optical member on a light emitting path of the light emitting apparatus.

Growing community of inventors

Seoul, South Korea

Won Jin Son