Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Sdi Co., Inc.

Samsung Sds Co., Ltd.

Naieel Technology

Won-Il Lee

Cha-Jea Jo

Ji-hwang Kim

Jong-bo Shim

Joo-Young Lee

Hwan-hee Jeong

Nam-Jin Jang

Sang-Uk Han

Sunhwa Kim

Seung-Mock Ro

Jongseon Park

Anil Agiwal

Young-Bin Chang

Jae-Young Kim

Taori Rakesh

Hwan-Hee Jeong

Hyeong-Cheol Ahn

Hyo Jin Yoon

Minseop Kim

Jin Young Kim

Seung-Joon Yoo

Yun-Hee Kim

Su-Kyung Lee

Younhwan Jung

Cheol-Hyeon Chang

Jaewoo Kim

Young-Min You

Jung-Ho Kang

Youn-Hwan Jung

Jun Ki Kim

Zin-Min Park

Byughoon Chae

Tae Jin Kim

Jin Yeop Chang

Young-Soo Seo

Jin-Seok Jang

Chung Hyeok Lee

Duckbong Seo

Sang-uk Han

Ji-Ryong Jung

Da-Ki Min

An input sensor including a first electrode and a second electrode, which cross each other. The first electrode includes a first main portion extending in a first direction and first sensing portions and second sensing portions, which are disposed with the first main portion therebetween in a second direction and each of which extends from the first main portion. Each of the first sensing portions and the second sensing portions includes first sub-portions extending in the first direction and first middle portions disposed between the first sub-portions and between one of the first sub-portions and the first main portion.

Display device

An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

Image sensor package

Provided is a display device including a display panel and an input sensing layer including an effective region and a non-effective region. The input sensing layer includes a plurality of sensing electrodes, a plurality of signal lines, and a plurality of input pads. The non-effective region includes a first region, a second region, and a third region, and the signal lines include first sub-lines in the first region and connected to the sensing electrodes, second sub-lines in the second region and connected to the input pads, and third sub-lines in the third region and connecting the first sub-lines and the second sub-lines. An interval between the third sub-lines in the third region is a first interval which is a constant, and the first interval is smaller than a second interval between the first sub-lines and a third interval between the second sub-lines.

Display device and electronic device including the same

An input sensor includes a first pattern and a second pattern overlapping with the first pattern with an intermediate insulating layer interposed therebetween. The second pattern is disposed on the intermediate insulating layer and connected to the first pattern via a contact hole defined through the intermediate insulating layer. The first pattern includes a first mesh line extending along a reference direction, and the second pattern includes a second mesh line extending along the reference direction and overlapping with the first mesh line. An edge of the first mesh line and an edge of the second mesh line are not aligned with each other along a direction perpendicular to a line width direction and the reference direction.

Input sensor and display device having the same

The boron nitride nanostructure according to an embodiment of the present invention forms defects through surface modification and incorporates the metallic nanoparticles on the surface defects.

Surface-modified boron nitride nanostructure and method for producing same

A touch display device includes a touch screen, a display panel, a window member, and an adhesive layer. The display panel is configured to display an image and includes a first curved surface area. The window member is disposed on the display panel and includes a second curved surface area disposed in correspondence with the first curved surface area. The adhesive layer is disposed between the display panel and the touch screen panel and is configured to block light in at least a portion thereof. The display panel is disposed between the window member and the touch screen panel.

Touch display device and method of manufacturing the same

A semiconductor package includes a substrate, a rewiring layer, a plurality of semiconductor chip stack structures, and a second semiconductor chip. The rewiring layer is disposed on an upper surface of the substrate. The rewiring layer includes a concave portion. The semiconductor chip stack structures include a plurality of first semiconductor chips. The first semiconductor chips are disposed on the rewiring layer. The first semiconductor chips are spaced apart from each other in a horizontal direction. The second semiconductor chip is disposed within the concave portion. The second semiconductor chip is configured to electrically connect each of the plurality of semiconductor chip stack structures to each other.

Semiconductor package including a rewiring layer with an embedded chip

Methods of manufacturing a semiconductor package are provided. The methods may include manufacturing a semiconductor chip in a first semiconductor manufacturing environment and mounting the semiconductor chip on an upper surface of a printed circuit board. The method may also include forming a molding member in a second semiconductor manufacturing environment that is different from the first semiconductor manufacturing environment, forming a capping member including a material different from the molding member and covering an exposed outer surface of the molding member, and attaching a carrier substrate onto the capping member. The semiconductor chip may be between the printed circuit board and the carrier substrate. The method may further include forming a redistribution line layer on a lower surface of the printed circuit board in a third semiconductor manufacturing environment, forming an external connection member on the redistribution line layer, and removing the carrier substrate.

Methods of manufacturing semiconductor packages

A display device, including a display panel that displays an image; a flexible printed circuit board including an attaching part attached to one end of the display panel and a curved part extending from the attaching part and not overlapping with the display panel; a window assembly on an upper surface of the display panel; an adhesive part between the window assembly and the display panel to couple the display panel and the window assembly; and a compensating part not overlapping with the display panel, overlapping with the curved part, and on a same layer as the attaching part.

Display device having bent circuit board and portable terminal having the same

A display apparatus including a display panel, a buffer, and a curved buffer. The display panel includes a curved portion connected to a flat portion. The buffer overlaps the flat portion and having a first thickness. The curved buffer is on a same layer as the buffer and overlaps the curved portion, the curved buffer having a second thickness greater than the first thickness.

Display apparatus and portable terminal

Wireless network connection control method of performing control for establishing and releasing wireless network connection with another device when impacts are applied to devices, application program control method of performing control for setting and executing application program when impacts are applied to devices, and device including wireless network connection control function and application program control function which use a device impact are disclosed. According to the present invention, provided is a wireless network connection control method of a device using a device impact, including generating a corresponding impact event when physical impact applied from the outside is sensed, transceiving a search message between devices based on a time at which the impact event occurred, searching for another device in which the impact event has occurred at the same time, and performing a predetermined protocol with a corresponding device according to a search result and establishing an inter-device wireless network connection.

Wireless network connection controlling method using device impact, application program controlling method, and devices thereof

Provided is a battery pack. The battery pack includes; a first battery cell and a second battery cell; a protection circuit module (PCM) that is located between the first and second battery cells and is electrically connected to the first and second battery cells; a thermal sensor that is electrically connected to the PCM and measures a temperature of the first battery cell; and a frame that accommodates the first battery cell, the second battery cell, and the PCM, wherein the frame includes a seating unit on which the PCM is seated, and the seating unit comprises a hole for inserting the thermal sensor to fix a position of the thermal sensor. Accordingly, damage to the thermal sensor is prevented and reliability of the thermal sensor is increased.

Battery pack

Growing community of inventors

Hwaseong-si, South Korea

Won-Il Lee