Samsung Electronics Co., Ltd.

Won-hwa Lee

Seok-Chan Lee

Junghoon Kim

Jin-young Choi

Jinyoung Choi

Jung-hoon Kim

Heeyoub Kang

Jong-yun Yun

Joon-young Oh

Dongok Kwak

Joonyoung Oh

Jae-beom Byun

Jae-Woo Jeong

Hee-youb Kang

Jaebum Byun

A secondary memory device includes: a substrate and a housing configured to accommodate at least a part of the substrate. The substrate has upper and lower opposed surfaces and includes a first region in which a first semiconductor device is mounted on the upper surface and a second region in which a second semiconductor device is mounted on the upper surface. The housing includes a first sub-housing covering the upper surface of the substrate at the first region and the first semiconductor device. The first sub-housing does not extend to cover the upper surface of the substrate at the second region.

Secondary memory device

A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.

Semiconductor module

In one embodiment, the stacked package includes a first chip disposed over a package substrate. The first chip has at least one first chip dummy pad, and the first chip dummy pad is not electrically connected to circuits of the first chip. A first dummy bonding wire is connected to the first chip dummy pad and the package substrate. A second chip is disposed over at least a portion of the first chip, and the second chip has at least one second chip bonding pad. A first bonding wire is electrically connected to the second chip bonding pad and the first dummy bonding wire.

Stacked package and method of manufacturing the same

Growing community of inventors

Seoul, South Korea

Won-hwa Lee