Lg Chem, Ltd

Denso Corporation

Lg Innotek Co., Ltd.

Won Ho Kim

Seung Hwan Kim

Kyung Tae Kim

Jang Soon Kim

Sung Chan Park

Eun Kyung Park

Chan Oh Yoon

Bu Gi Jung

Kwang Ki Choi

Makoto Tanaka

Kazuoki Matsugatani

Chong Cook Kim

Moonil Kim

Jae Gwan Lee

Yeo Jae Yoon

Jaegwan Lee

Deok Won Seo

Young Sung Cho

An embodiment discloses a semiconductor device comprising: a semiconductor structure comprising a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first electrode disposed on the first conductive semiconductor layer; a 2-1 electrode disposed on the second conductive semiconductor layer; and a 2-2 electrode disposed on the second conductive semiconductor layer and spaced apart from the 2-1 electrode, wherein the thickness of a part of the second conductive semiconductor layer between the 2-1 electrode and the 2-2 electrode is smaller than the thickness of the second conductive semiconductor layer vertically overlapping with the 2-1 electrode and the 2-2 electrode; the 2-2 electrode is opposite to the 2-1 electrode and comprises a first region that is closest to the 2-1 electrode; the 2-1 electrode is opposite to the 2-2 electrode and comprises a second region that is closest to the 2-2 electrode; and the relationship between the width (W) of the first region and the width (W) of the second region is W&#x2265;W

Semiconductor device

The present invention relates to an optical adhesive film including plate-type inorganic nanoparticles and a curable resin. The optical adhesive film has improved barrier characteristics to moisture and gas, improved light-transmittance, and excellent durability and peel characteristics.

Optical adhesive film, method for manufacturing optical adhesive film and touch screen panel comprising same

Provided is a urethane adhesive composition for a touch panel having a glass transition temperature between &#x2212;20&#xb0; C. to &#x2212;50&#xb0; C., and which, as a cured composition, has an elasticity of 50,000 Pa to 70,000 Pa at 60&#xb0; C. to 80&#xb0; C.

Adhesive composition for touch panel, adhesive film, and touch panel

Provided are an adhesive composition for a touch panel, including: a hydrophilic functional group-containing monomer and an adhesion promoter, wherein a dielectric constant at a frequency of 100 kHz to 2 MHz is 3.5 or less, and a storage modulus is 1.0&#xd7;10Pa to 7.0&#xd7;10Pa at 25&#xb0; C. to 85&#xb0; C., and an adhesive film including an adhesive layer including a cured product of the adhesive composition for a touch panel. In addition, provided is a touch panel including: a conductive plastic film having a conductive layer formed on one surface; and an adhesive layer attached onto the conductive layer and including a cured product of the adhesive composition for a touch panel.

Adhesive composition for touch panel, adhesive film and touch panel

A first metal plate for transmission and a second metal plate for transmission are closely-attached to a first surface and a second surface of a dielectric body, respectively. An outer edge of the first metal plate substantially symmetrically faces an outer edge of the second metal plate via the dielectric body. A metal plate for matching is arranged inside a hole formed on the second metal plate, with a slit formed with an inner wall of the hole, and is fixed to the dielectric body. The metal plate for matching is electrically connected to the first metal plate via a through hole penetrating the dielectric body. An IC chip is surface-mounted to connect the second metal plate with the metal plate for matching.

IC tag and IC tag attachment structure

Growing community of inventors

Seoul, South Korea

Won Ho Kim