Samsung Electro-mechanics Co., Ltd.

Won Hee Yoo

Sang Moon Lee

Seok Kyoon Woo

Byeung Gyu Chang

Taek Jung Lee

Jae Young Na

Eun Kwang Lee

Ji Hong Jo

Yong Suk Kim

Sung Hyung Kang

Hyung Kyu Kim

Jong Hyun Cho

Byung Kil Yun

Jae Hee Kim

Yong Koo Kim

Hyun Sung Dong

Jin Man Jung

Han Seong Jung

Yun Hwi Park

Hyo Joong Kim

Min Seop Kim

Seol Gyeong Park

A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on each other interposing the dielectric layer therebetween, and external electrodes disposed externally on the body, respectively including a first layer connected to the internal electrode and a second layer covering the first layer, wherein the first layer includes a metal particle including an element A and a Z-A-O phase formed in the metal particle, and here, the element Z is an alkali metal.

Multilayer capacitor

An electronic component includes a plurality of dielectric layers; and a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with a corresponding dielectric layer interposed therebetween. One of the plurality of first internal electrodes includes a metal layer containing Ni and Sn, a first graphene layer disposed on a lower surface of the metal layer, and a second graphene layer disposed on an upper surface of the metal layer.

Electronic component and method of manufacturing the same

A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body, wherein a first carbon material is disposed in the internal electrode. The first carbon material includes carbon black, which has conductivity, a substantially spherical shape, and a particle diameter of 0.05 μm or less.

Ceramic electronic component

An electronic component includes a body including a plurality of dielectric layers, and a plurality of internal electrodes disposed with a corresponding one of the dielectric layers interposed therebetween; and an external electrode disposed on the body and connected to at least one of the plurality of internal electrodes. One of the plurality of internal electrodes includes an alloy metal including nickel, tin and aluminum. One of the plurality of internal electrodes includes a core internal electrode including a first surface and a second surface opposing each other, and a capping internal electrode disposed on the first surface of the core internal electrode and the second surface of the core internal electrode. The capping internal electrode includes a first alloy region including an alloy of nickel and aluminum.

Electronic component

A conductive powder for an internal electrode includes a metal particle and a graphene oxide disposed on at least a portion of a surface of the metal particle. A content of the graphene oxide is less than 1.0 weight percent, based on a weight of the metal particle.

Conductive powder for internal electrode and capacitor component including the same

An electronic component includes a body including a plurality of stacked dielectric layers and internal electrodes disposed with a corresponding dielectric layer interposed therebetween, and external electrodes disposed on the body and connected to corresponding internal electrodes. One of the internal electrodes includes a particle including Ni and Sn and a graphene layer disposed at a boundary of the particle. A ratio of an Sn content to a total content of Ni and Sn is Sn/(Ni+Sn), Sn/(Ni+Sn) of a first region located inside the particle at a first distance from a boundary between the particle and the graphene layer is A1, Sn/(Ni+Sn) of a second region located inside the particle at a second distance from a boundary between the particle and the graphene layer is A2, the second distance is smaller than the first distance, and A1 is smaller than A2.

Conductive powder particle for internal electrode and electronic component, and manufacturing method thereof

A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.

Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.

Thin film electrode ceramic substrate and method for manufacturing the same

The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

Method for forming electrode pattern of ceramic substrate

Disclosed are a probe substrate and a probe card using the same. The probe substrate includes a ceramic stack structure stacked with a plurality of layers; vias disposed in the ceramic stack structure to perform inner-layer connection, and pads electrically connected to the vias; a contact opening disposed at the ceramic stack structure, and partially exposing the pads; and contact pads disposed at side walls of the contact opening, electrically connected to the pads, and electrically connected to pogo pins.

Probe substrate with auxiliary contact pads and probe card therewith

Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.

Growing community of inventors

Suwon-si, South Korea

Won Hee Yoo