Samsung Electronics Co., Ltd.

Won-Gu Cho

Ju-Young Yoon

Weon-Sik Oh

Seung-jun Lee

Seong-Yong Hwang

Sung-Chul Kang

Hyeong-Suk Yoo

Hoon-Kee Min

Ho-Min Kang

Yun-Hee Kim

Jin-Suk Lee

Byoung-hun Lee

Jeong-ho Hwang

Mi-Sook Yim

Cheol-Yong Jeong

A display device includes a display panel, a driving chip, and a non-conductive adhesive film. The display panel includes a pad member having a plurality of conductive pads. The driving chip includes a body and a plurality of bumps. The body has a driving circuit. The bumps are protruded from the body to make contact with the pads, respectively. The non-conductive adhesive film fixes the driving chip to the pad member. Therefore, a manufacturing cost is decreased, and a yield is increased.

Driving chip, display device having the same, and method of manufacturing the display device

A bonding method of a flexible film is provided, which includes: positioning an anisotropic conductive film on a plurality of first signal lines formed on the flexible film to be bonded to a thin film transistor (TFT) panel; arranging the anisotropic conductive film on the TFT panel to align the first signal lines formed on the flexible film and a plurality of second signal lines formed on the TFT panel; positioning at least one portion of a protection film for protecting the second signal lines of the flexible film to be overlapped with the TFT panel; and pressing the flexible film and the TFT panel.

Bonding method of flexible film and display bonded thereby

In a drive IC and a display device having the same, the drive IC includes a plurality of bumps disposed on a lower surface of the drive IC and aligned in a plurality of rows along an edge of the drive IC. The bumps aligned in different rows from each other are juxtaposed in a direction perpendicular to a direction in which the bumps are aligned. Accordingly, when the drive IC is mounted on a display panel using an anisotropic conductive film, the anisotropic conductive film may be smoothly flowed through a space defined by the bumps of the drive IC, thereby improving electric properties of the drive IC and display device.

Drive IC and display device having the same

Disclosed are a displaying substrate and a liquid crystal display device having the same. A pad portion formed on the displaying substrate has a plurality of via holes for exposing a pad metal layer. A width of the via hole is smaller than a diameter of a conductive particle. Where the width of the via hole is larger than the diameter of the conductive particle, a depth of the via hole is smaller than the diameter of the conductive particle. Thus, a driving failure which may occur in the pad portion is prevented while maintaining a deformation ratio of the conductive particle at about 20&tilde;60%, thereby enhancing a connecting force between the pad portion and a circuit substrate.

Displaying substrate and liquid crystal display device having the same

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Seoul, South Korea

Won-Gu Cho