Amkor Technology Singapore Holding Pte. Ltd.

Amkor Technology, Inc.

Won Geol Lee

Won Chul Do

Ji Hun Yi

Won Myoung Ki

In Su Mok

Il Bok Lee

In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.

Semiconductor device and method of manufacturing a semiconductor device

Various aspects of this disclosure provide a semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising a stacked die structure and a method of manufacturing thereof.

Semiconductor device and method of manufacturing thereof

Semiconductor device having stacked dies and stacked pillars and method of manufacturing thereof

Growing community of inventors

Seoul, South Korea

Won Geol Lee